Search results for "diodes"

Semtech's RClamp0504N, a 5.0V protection device aimed at next-generation monitors, laptops, television set top boxes and networking equipment using high-speed I/O protocols, measures just 2.0 x 2.0 x 0.6 mm.

Semtech Corp has announced the RClamp™7002M, a two-line secondary protection device designed for use in ADSL and other wide area networking (WAN) equipment.

Maxim introduced the MAX14885E, a complete 2:2 VGA crossover switch that boosts the performance of switchable-graphics applications. This device routes signals from the internal VGA or add-in graphics chip to either the docking station or the VGA port on the notebook. The device's low 6.5pf (typ) on-capacitance and 5ohm on-resistance enable it to provide 2x more bandwidth (up to 700MHz) than existing solutions.

Cree announced today that it has achieved a major breakthrough in the development and wide scale commercialization of silicon carbide (SiC) technology with the demonstration of high quality, 150-mm SiC substrates with micropipe densities of less than 10/cm2. The current Cree standard for SiC substrates is 100-mm diameter material.

Cree, Inc. has introduced the industry’s first fully qualified commercial silicon carbide power MOSFET. This establishes a new benchmark for energy-efficient power switches and can enable design engineers to develop high-voltage circuits with extremely fast switching speeds and ultralow switching losses.

ROHM Semiconductor announces the availability of the SCS1xxAGC series of high-performance silicon carbide (SiC) Schottky barrier diodes (SBD).

Manufacturers of solar panel modules can increase their productivity with a new type of junction box from Multi-Contact. Called the Foxbox, the compact box has been designed for use in the automated assembly of polycrystalline photovoltaic (PV) arrays.

Maxim has introduced the MAX13223E, a ±70V fault-protected, dual-channel RS-232 transceiver. Pin compatible with the industry-standard MAX3223E, the MAX13223E is the first overvoltage-protected RS-232 transceiver on the market. It integrates ±70V fault protection on the RS-232 interface pins, thus eliminating the need for external fault-protection circuitry, such as polyswitch limiters and zener diodes.

NXP Semiconductors announced the availability of SOD882D, the industry’s first leadless package with solderable, tin-plated side pads. The SOD882D is a 2-pin plastic package measuring only 1mm x 0.6mm and is ideal for small and thin devices. With a height of only 0.37 mm (typical), it is also one of the flattest packages in the 1006-size (0402 inch) and is available in various ESD protection and switching diodes.

Based on its recent analysis of the automotive light-emitting diodes (LED) market, Frost & Sullivan recognizes Philips Lumileds with the 2010 Global Frost & Sullivan Award for Technology Innovation of the Year for being a major factor driving the advance of improved lighting technologies for the global auto industry.