Search results for "tvs diodes"
Littlefuse develops new SDP Series SOT23-5 of Broadband Protection Thyristors
Littelfuse has developed a new series of broadband protection Thyristors, designed for use in the tertiary or line driver side protection position for ADSL2 and VDSL2, and the 30MHz bandplan of VDSL2+ applications and general I/O protection functions.
ProTek Devices Launches New Business Line Targeted at LED Lighting Manufacturers
ProTek Devices today announced a new business line currently targeted at LED lighting manufacturers. The product line consists of individual unpackaged die available in wafer form. The die in wafer form are available as unidirectional and bidirectional electrostatic discharge (ESD) protection diodes. ProTek Devices' new LED die solutions meet various LED lamp manufacturing needs. In addition to LED lighting manufacturers, other applications inclu...
Ohmite Manufacturing Showcases New Electronic Components at Electronica 2012
Ohmite Manufacturing announces that it will showcase its newest products at Electronica 2012, in Munich Germany. They show is taking place from November 13-16, and Ohmite will be in Hall B6, Booth #334. Products on display include Ohmite’s D Series of heat sinks, FC4L Series of resistors, and CP4 Series of cold plate four-pass heat sinks.
Keithley introduce 7 flexible parametric curve tracer solutions for power device characterization
Keithley Instruments has introduced seven instrumentation, software, and test fixture configurations for parametric curve tracing applications for characterizing high power devices at up to 3,000V and 100A. They’re optimized to provide the industry’s most cost-effective solution for characterizing the growing number of high power semiconductor devices, including those based on silicon carbide and gallium nitride technology.
Fujitsu Develops Eye Tracking Technology
Fujitsu Laboratories Ltd. today announced development of eye tracking technology that takes advantage of compact, inexpensive cameras and light-emitting diodes (LED) embedded in PCs. Up until now, tracking eye movements required a specialized camera and LED, the prohibitive cost and size of which made it difficult to use in PCs and other general-purpose products. Moreover, less expensive equipment was of insufficient quality, and blurred images m...
Diodes Inc announces first Schottky diode in miniature leadless DFN0603 package
Diodes Inc have announced its first Schottky diode to be offered in the miniature leadless DFN0603 package. Handling switching, reverse-blocking and rectification functions, the 30V, 0.1A-rated SDM02U30LP3 meets the higher density design requirements of ultra portables, including smart phones and tablets.
Marvell wins two prestigious American business awards
Marvell today announced that its 88DE3100 HD Media Process System-on-Chip (SoC) has received two esteemed American Business Awards in the “Best New Hardware Product or Service” and “Favorite Hardware People’s Choice” categories.
Agilent Technologies to Demonstrate Newest Microwave and RF Design and Test Solutions
Agilent Technologies today announced it will show its newest microwave and RF design, test and measurement solutions for the aerospace, defense, research, education, communications, transportation and medical markets at European Microwave Week (Booth 114), Oct. 29- 31, at the RAI convention center in Amsterdam.
Diodes enters into agreement to acquire power analog microelectronics
Diodes today announced that it has entered into an agreement to acquire Power Analog Microelectronics, Inc. The acquisition is expected to close in the fourth quarter of 2012. The terms of the transaction were not disclosed.
Infineon Introduces 5th Generation thinQ! SiC Schottky Barrier Diodes Delivering Market Leading Efficiency
Infineon today announces the expansion of its SiC portfolio with the introduction of the 650V thinQ! SiC Schottky Barrier Diodes Generation 5. Infineon’s proprietary diffusion soldering process, already introduced with Generation 3, is now combined with a new, more compact design as well as latest advancements in thin wafer technology bringing improved thermal characteristics and a Figure of Merit (Q c x V f) in the order of 30% lower with ...