Search results for "ai safety summit"
Lauterbach and Kernkonzept enable virtualised RISC-V systems
Lauterbach and Kernkonzept enable architects of virtualised software systems to start development and testing on future RISC-V platforms even before corresponding System-on-Chips (SoCs) are available in silicon.
Keysight releases benchtop AI tester
Keysight Technologies has unveiled theInterconnect and Network Performance Tester 800GE Benchtop, a new multiport, multi-user, and multi-speed portable design and validation platform that tests artificial intelligence (AI), high-performance computing (HPC), data centre interconnects (DCI), and network infrastructure.
ZF’s new 800V Test & Validation Laboratory in the UK
ZF recently opened the UK’s first-of-its-kind HV Test & Validation Laboratory at its R&D Hub near Solihull.
Infineon hosts first-ever Supplier Sustainability Summit
Infineon hosted its first-ever Supplier Sustainability Summit to further stimulate collaboration and incentivise and support suppliers to accelerate their decarbonisation journeys. The virtual event brought together about 100 top semiconductor industry suppliers.
AR is getting smaller to make a bigger impact
Researchers are working on makingaugmented reality(AR) systems smaller and more practical for everyday use by integrating them into standard eyewear.
Automotive industry comes together to discuss chiplets
At an exclusive event in Ann Arbor, Michigan, the Automotive Chiplet Forum 2024 brought together key players in the global automotive ecosystem to discuss the shift towards chiplets in vehicles.
New VelocityDRIVE software platform for SDVs
Driven by the need for higher bandwidth, advanced features, enhanced security and standardisation, automotive OEMs are transitioning toEthernet solutions.
Innoscience unveils new generation of BMS solutions
Innoscience Technology, developing cost-effective, high-performance gallium-nitride-on-silicon (GaN-on-Si) power solutions, has introduced a new generation of battery management system (BMS) solutions built on its proprietary VGaN technology.
ODU MEDI-SNAP: Maximum performance in minimal space
In today’s fast-paced world, efficiency is key - whether it’s saving money, time, or space. ODU is responding to the demand for more compact and lightweight solutions with its ODU MEDI-SNAP Size 3.5, designed to meet the highest standards for transmitting signals, power, fluids, or a combination of all. This connector delivers top-tier performance while minimising weight and space, providing a robust and touch-proof design that is bot...
Curbing AI power consumption in data centres
As data centres continue to accommodate the growing AI industry, curbing AI power consumption in data centres has become a critical problem.