Search results for "Yole"

As the development of packaging technologies intensifies, in order to accommodate further front-end scaling trends and multi-die integration, advanced FO RDL and FC substrates represent the key interconnect components. The competition between FO and FC packages and the features of their interconnect components is resulting in an abundance of new package architectures that are crucial in enabling future products and markets.

It is believed that 3D imaging, gas sensing and autofocus will fuel the Infra-Red (IR) light source market.The More than Moore market research and strategy consulting company, Yole Développement (Yole), has announced a $1.5bn opportunity in 2022 in multiple applications and potentially $3.8bn in 2027.“Some applications will generate large revenues and strong growth rates during the next five years,” explained Pars Mukish, Busin...

Microsemi and Analog Devices have announced a scalable SiC driver reference design solution at PCIM Europe 2017. The solution is based on a range of Microsemi SiC MOSFET products and ADI’s ADuM4135 5KV isolated gate driver. Both companies are exhibiting in PCIM's Hall 6; Analog Devices are on stand458, andMicrosemi on stand 318.

2016 was the year of strong consolidations in the semiconductor industry and Yole Développement (Yole) highlighted many mergers and acquisitions. “2017 seems to be following the same path”, wrote Jérôme Azemar, Technology & Market Analyst, Advanced Packaging at Yole. Year after year, the advanced packaging industry has attracted more and more of the spotlight.

With a combined 500 booths, the exhibitions and conferences of LED Taiwan, opening 12th April in Taipei, will attract over 12,000 visitors.Organised by SEMI and the Taiwan External Trade Development Council (TAITRA), LED Taiwan will be held simultaneously with 2017 Taiwan International Lighting Show (TiLS).

The 'More than Moore' market research and strategy consulting company, Yole has released a new technology and market report focused on Bulk GaN substrate, titled 'Bulk GaN Substrate Market'.

"MicroLED could emerge as a new display application with unique performance benefits”, commented Dr Eric Virey, Senior Technology and Market Analyst at Yole Développement (Yole). “But there are still numerous challenges ahead”.Interest in microLED displays has grown exponentially since the acquisition of Luxvue by Apple in 2014.

In order to produce a new dual-camera zoom reference design for mobile devices, OmniVision Technologies have announced its collaboration with dual-camera technology company Corephotonics. Combining OmniVision’s OV12A10 and OV13880 image sensors with Corephotonics’ proprietary zoom and Bokeh algorithms, the reference design brings optical zoom capabilities commonly found in DSCs and DSLRs to smartphone camera applications.

More than 1,000 international buyers from over 60 countries and manufacturers will convene atLED Taiwan 2017at Taipei Nangang Exhibition Hall on April 12-15th.

The MEMS & sensor offering has never been so diverse. Inertial, pressure, temperature, (bio-)chemical and gas sensors as well as microphones, fingerprint and iris recognition. All devices are part of the IoT revolution.Yole Développement (Yole) analysts are currently noting plenty of excitement within the MEMS & Sensors sector. Dream or reality: what is the status of IoT applications?