Search results for "Qt group"

Smiths Interconnect has expanded its range of high-frequency surface mount chip attenuators with the introduction of the TSX Wire Bondable Fixed Chip Attenuator Series.

Europe's technology sector is experiencing critical deficiencies in skills, investment, and innovation, particularly in areas such as AI, quantum computing, and space technology, according to a DIGITALEUROPE report.

Paige West speaks with Steve Hanna of Infineon Technologies and Chair of the Product Security Working Group Steering Committee about the new IoT Device Security Specification.

At embedded world 2024, Cadence and Dream Chip demonstrated Dream Chip’s latest automotive SoC, which features the Cadence Tensilica Vision P6 DSP IP and Cadence design IP controllers and was taped out using the complete Cadence Verification solution and full-flow digital implementation, including signoff.

Richardson Electronics, an global provider of engineered solutions and RF and Microwave technologies, will be showcasing its latest technology partners at the 2024 IEEE MTT-S International Microwave Symposium, which will be held from 16–21 June 2024 in Washington, DC.

NVIDIA researchers are at the forefront of the rapidly advancing field of visual generative AI, developing new techniques to create and interpret images, videos, and 3D environments.

Rohde & Schwarz has successfully validated mission-critical push-to-talk protocol conformance test cases for the Global Certification Forum (GCF) and achieved Test Platform Approval Criteria (TPAC) for its R&S TS-PCT protocol conformance tester.

Maastricht Aachen Airport (MST) is to host the first publicly accessible electric powered flights between the Netherlands, Belgium, and Germany having successfully facilitated a joint venture initiative.

Smart Manufacturing & Engineering Week 2024 celebrates its ‘buzziest’ ever year with new record attendance.

Yole Group has provided a comprehensive review of UWB technologies, highlighting and comparing the solutions implemented in smartphones by leading companies, Apple (with their internal U2 module), Samsung (with SR200 solution from NXP), and Google (with DW35725 solution from Qorvo).