Search results for "NXP"

NXP Semiconductors announced its new NXP analogue front-end (N-AFE) family for high-precision data acquisition and condition monitoring systems for factory automation. Designed as software-configurable universal analogue input devices, the new N-AFE family helps enable the software-defined factory, making it easier for operators to configure a smart factory and adjust settings based on shifting market needs.

MikroElektronika (MIKROE) has introduced a new motion sensor Click board, to support the development of intrusion alarms, automatic door openers, presence-sensing applications, and more.

SYSGO's real-time operating system and hypervisor PikeOS has again reached the highest levels of rail and industrial safety standards.

NXP’s MCX N Series ushers in a new era of smart, efficient edge processing; featuring high-performance, low-power microcontrollers with smart peripherals and accelerators.Designed to simplify design for secure intelligent edge applications, including IoT and industrial applications, the MCX N Series introduces the first instantiation of NXP's proprietary neural processing unit (NPU) with high levels of integration and precision analog.To ...

Chip design company Arm is moving to make its own chip in efforts to showcase the capabilities of its designs.

A group of semiconductor companies in Flanders have come together to create Flanders Semiconductors, a new non-profit organisation representing the interests of the industry at local, European, and global levels.

NXP Semiconductors has announced its collaboration with the German Aerospace Centre (DLR) and other partners on ion trap-based quantum computers as part of the DLR’s Quantum Computing Initiative.

The global NFC chip market is valued at $1.9 billion in 2023 and is predicted to progress at a CAGR of 15% from 2023 to 2033.

The growing EV industry, increasing calls for renewable energy adoption, the automation trends in the industrial sector, and the rising demand for consumer electronics, are fuelling the growth of the power electronics industry as manufacturers set their sights on power efficiency, carbon reduction, and 'greener' energy.

The power electronics landscape is changing. Wide-bandgap (WBG) devices, including gallium nitride (GaN) and silicon carbide (SiC), are gaining traction in replacing silicon devices, which are reaching their theoretical limits in performance, in applications including power modules and power inverters, motor drives, and chargers and adapters, to name a few.