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Electronic Specifier highlights the top 10 stories fromelectronica 2024, the world’s leading trade fair for electronics.

TDK has unveiled its new InvenSense SmartSonic ICU-10201 high-performance ultrasonic Time-of-Flight (ToF) sensor with an embedded processor and extended memory space.

Renesas Electronics announced the world's first ‘8-in-1’ proof of concept (PoC) for E-Axle systems forelectric vehicles (EV), which controls eight functions using a single microcontroller (MCU).

Digitalisation, AI, and automation are intensifying demands on data centre (DC) IT infrastructure, driving the need for effective cooling solutions.

Mahdi Yahya, CEO and Founder of Ori, a UK provider of GPUs for AI compute, argues that the UK has all the ingredients necessary to build its own sovereignCloud computing infrastructure– but it’s being held back by a lack of imagination from senior tech players.

KIOXIA Europe GmbH, announces that it has begun mass production of the industry’s first[1] Universal Flash Storage (UFS)[2] Ver. 4.0 embedded flash memory devices with four-bit-per-cell, quadruple-level cell (QLC) technology.

Anritsu has announced full support for 5G and LTE Next Generation eCall (NGeCall) validated test cases on its 5G NR Mobile Device Test Platform ME7834NR enabling GCF certification.

Anritsu and Bluetest have combined their recent product upgrades to create an Over-the-Air (OTA) measurement solution in a MIMO environment for verifying RF performance in the tri-frequency bands of the latest WLAN standard (IEEE 802.11be).

onsemi’s PowerTrench T10 MOSFETs have beenshortlisted for the Electronics Excellence Awardsunder the Power Product category.

Welcome to the shortlist announcement page! Here you will find the amazing, shortlisted products for the most rigorous and transparent award in the industry.