Search results for "Master Bond"
CDS unveils new VUE range of displays
Crystal Display Systems (CDS), a provider of innovative display solutions, is thrilled to announce the launch of its VUE range of displays.
Seeing robots process large work area with high precision
The automation specialist AKEOPLUS has developed an innovative robotic cell for the production of satellite panels at the global space manufacturer Thales Alenia Space.
Indium hosts webinar on lead-free solder paste for automotive applications
Indium Corporation’s Senior Research Metallurgist, Jie Geng, PhD., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.
Advancements in silicone elastomers enhance soft robotics manufacturing
Researchers at Rice University have made strides in the field of soft robotics by developing an analytical model that precisely predicts the curing time of platinum-catalysed silicone elastomers based on temperature.
Nemo Nanomaterials unveils 50-tonne production line
Nemo Nanomaterials, an Israeli firm specialising in nanomaterial-based industrial additives, has recently launched a production facility capable of generating 50 tonnes annually of its NemoBLEND nanomaterial-based additives.
Drone innovators win £500,000 to improve UK medical supply chain
£500,000 has been allocated to support five projects within the health sector that utilise drones for the delivery of medicines and medical supplies.
Christopher Haas appointed Managing Director of TDK-Lambda Germany
TDK has announced the appointment of Christopher Haas as Managing Director at TDK-Lambda Germany from 1st April 2024.
IAR sets standard with support for Renesas’ RISC-V MCUs
IAR announced enhancements to its premier development environment, supporting the first general-purpose 32-bit RISC-V microcontrollers (MCUs) featuring Renesas’ internally developed CPU core.
Dielectric trends in next-gen semiconductor packaging
The semiconductor industry continually pushes packaging technology boundaries to meet the demand for higher chip performance and efficiency.
New advanced packaging 3D CT AXI solution
Test Research, Inc. (TRI) announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.