Search results for "Photonic Microsystems"
BPM Microsystems Turns 25 in 2010
BPM Microsystems, a leading provider of device programming solutions to the electronics industry, is proud to announce that it has reached the 25-year mark in the device programming business. Since 1985, BPM Microsystems has lead the industry with innovative products and award-winning customer service.
Baolab creates nanoscale MEMS inside the CMOS wafer
Baolab Microsystems has announced a new technology to construct nanoscale MEMS (Micro Electro Mechanical Systems) within the structure of the actual CMOS wafer itself using standard, high volume CMOS lines, which is much easier and quicker with fewer process steps than existing MEMS fabrication techniques that build the MEMS on the surface of the wafer. This significantly reduces the costs of a MEMS by up to two thirds and even more if several di...
New Scale Technologies introduces “mechatronics on a fingertip” with high resolution, low power use
New Scale Technologies today announced its M3 (Micro-Mechatronic Module) Design Platform for rapid development of custom closed-loop micro actuator modules. Building on the company’s miniature SQUIGGLE motor and TRACKER position sensor technology, this design platform yields a complete closed-loop actuator on a printed circuit board of 12 x 30 mm or less. Modules have low power consumption and 3.3V input voltage for battery-powered operatio...
Molex Demonstrates World’s First 100 Gbps Integrated Optical Transceiver Products
Molex Incorporated has successfully demonstrated the industry’s first single chip CMOS photonics-based 100 Gbps optical interconnect to support next-generation cloud computing, data centre and high performance computing connectivity. In a collaborative partnership with Luxtera, the new Molex silicon photonics-based active optical devices comprise four 28 Gbps transmit and receive channels powered from a single laser for an aggregate data ra...
Molex Purchases Luxtera’s Silicon Photonics-based Active Optical Cable (AOC) Business; Partners on Future AOC Development
Molex, a global leader in the high speed interconnect marketplace, today announced that it has completed the acquisition of Luxtera’s Active Optical Cable (AOC) business. Luxtera, the worldwide leader in Silicon CMOS Photonics, will transfer all aspects of its existing and future AOC business to Molex including current QSFP+ (Quad Small Form Factor Pluggable) 40Gbps Ethernet and InfiniBand products and customers. The acquisition immediately...
All "Electronic" roads lead to Munich for electronica 2006
Messe Muenchen International, organiser of electronica 2006, has announced final details for this year’s event. It will be staged at the New Munich Trade Fair Centre from November 14th to 17th inclusive. The Fair will occupy a total of 152,000m² across 14 exhibition halls and the organisers are confident that more than 75000 visitors will get the opportunity to view the products and services of more than 3000 exhibitors. Full details are avail...
Messe München To Hold Seven Electronics and Photonics Events During 2007
Messe München International, organizer of the industry-leading electronica exhibition, announces its exhibition schedule for 2007. A total of seven events will be staged: Two world-leading trade shows in Munich, Germany and five premier regional exhibitions in emerging markets around the world.
LASER 2007. World of Photonics claims more exhibitors and visitors than ever
Study reveals challenges ahead for GigE Vision
The emerging GigE Vision standard contains significant gaps and shortcomings that will slow its uptake in digital machine vision applications, according to a report and white paper jointly prepared by the Institute of Photonic Microsystems (IPMS) of the Fraunhofer Institute and Sony Europe’s Image Sensing Solutions Division (ISS).
MOSIS to unveil affordable access to 65nm wafer fab technologies at DATE 2007
At the upcoming DATE 2007 show, MOSIS, the multi-project wafer (MPW) service provider, will introduce low cost access to the latest 65nm wafer fabrication technologies from IBM, including the foundry’s low power and RF technologies. The MOSIS service is based upon multiple integrated circuit designs sharing each mask set and wafer. Costs are shared between users of the service, based upon the silicon area that each design occupies. This makes ...