Search results for "chip capacitors"

Avnet ASIC has announced that it has launched its new low-power design services for TSMC's 4nm and below process technologies.

Winbond’scustomised ultra-bandwidth elements(CUBE) technology is engineered to meet the rapidly growing demands of AI applications on Edge platforms.

NXPreceives a certification from the Car Connectivity Consortium, enhancing security, safety and ease of access through digital keys.

High voltage applications such as EV power frequently require high voltageresistorswith high accuracy for voltage division, monitoring, and control.

MIKROE has announced a new Click Snap feature which reduces size, weight and power consumption for second-level prototyping and production.

Rohde & Schwarz says it has developed the industry’s first ASIC-based zone triggering, implemented in the new MXO series oscilloscopes.

KYOCERA AVX, a global manufacturer of advancedelectronic componentsengineered to accelerate technological innovation and build a better future, has expanded its line of KAM Series automotive MLCCs with the addition of 20 new components.

Texas Instruments (TI) has launched six new MagPack power modules designed to improve power density, enhance efficiency, and reduce EMI.

Teledyne e2v has announced the successful space qualification of its 8GB space DDR4 memory as part of its Edge compute solutions for space.

Crypto Quantique, a provider ofquantum-driven securityfor the Internet of Things (IoT), has announced three new partnerships with intellectual property (IP) distributors in the Asia-Pacific region, Kaviaz Technology for Taiwan, LoMicro for China, and KRM for Japan and Korea.