Search results for "ai safety summit"
Vishay IGBT and MOSFET drivers enable compact designs, fast switching, and high voltages
Vishay Intertechnology has introduced two new IGBT and MOSFET drivers in the compact, high isolation stretched SO-6 package. Delivering high peak output currents of 3A and 4A respectively, the Vishay Semiconductors VOFD341A and VOFD343A offer high operating temperatures to +125°C and low propagation delay of 200ns maximum.
SEMICON Europa to explore advanced packaging and fab management
Semiconductor industry experts will convene at SEMICON Europa 2024,12–15 November 2024 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.
Littelfuse launches RCMP20 Residual Current Monitor Series
Littelfuse, an industrial technology manufacturing company empowering a sustainable, connected, and safer world, has announced the RCMP20 Residual Current Monitor Series for Mode 2 and Mode 3 EV charging stations.
Infineon and Green Hills Software present integrated platform
Infineon and Green Hills Software have launched an integrated microcontroller-based processing platform for safety-critical real-time automotive systems.
TDA4VM - Dual Arm Cortex-A72 SoC and C7x DSP with deep-learning, vision and multimedia accelerators
The TDA4VM processor family targeted at ADAS and AV applications and built on extensive market knowledge accumulated over a decade of TI’s leadership in the ADAS processor market. The unique combination high-performance compute, deep-learning engine, dedicated accelerators for signal and image processing in a functional safety compliant targeted architecture make the TDA4VM devices a great fit for several industrial applications, such as: R...
STMicroelectronics enhances IoT module for metering and tracking
STMicroelectronics is making large-scale IoT deployments easier to connect and manage with new enhancements to its cellular data-communications module, accelerating the adoption of sustainable smart grids and smart industry.
Rohde & Schwarz, Skylo achieve “significant milestone” for NB-NTN test
Rohde & Schwarz and Skylo Technologies have verified and validated all of the test cases defined in Skylo’s network operator acceptance criteria, including newly added test cases for SMS over NB-NTN, using the advanced CMW500 wideband radio communication tester.
Renesas four-channel master IC and sensor signal conditioner
Renesas has introduced two semiconductor solutions for the rapidly growing IO-Link market: the CCE4511 four-channel IO-Link master IC and the ZSSC3286 - IO-Link ready, dual-channel resistive sensor signal conditioner IC.
SYSGO and NexCOBOT announce partnership
SYSGO, specialist European provider of safety and security-critical systems, and NexCOBOT, a division of NexCom specialising in intelligent robotic control solutions, have entered into a joint technology partnership to provide the industrial robotics market with innovative and functional safety-certifiable solutions focused on Collaborative Robots (Cobots).
PIC Summit stresses aiding photon chip growth
More than 700 key figures from the semiconductor and photonic chip sectors have gathered in Eindhoven for one of the largest summits of its kind to discuss the industry's future.