Search results for "tvs diodes"
LML-530-GB – New Stabilised 530nm Single Mode Laser Module
LASER COMPONENTS would like to introduce the new stabilised 530nm single-mode laser module, LML-530-GB, as the newest product in PD-LD Inc’s extensive portfolio of laser diodes for spectroscopic, biomedical and process control systems.
The Optoelectronics Company Launches New Range of Laser Collimators
The Optoelectronics Company has introduced a range of tiny laser diode collimators with high alignment accuracy specifically aimed at OEMs and system integrators using laser based technology in their products.
iWatt 6-Channel LED Driver with Intelligent Digital Control Engine Simplifies Design, Reduces BOM for Mid to Large-Size LCD TVs
iWatt Inc today announced its latest LED driver for LCD TV backlighting. The new iW7011 is a 6-channel LED driver with a built-in intelligent digital control engine, developed to reduce the bill of materials (BOM) cost and simplify design of edge-lit and direct-lit LCD TVs. The digital core of the iW7011 provides on-chip control of the DC-to-DC boost circuit, along with precise LED dimming control and all the monitoring and feedback for the LED d...
Limitless variation from SUYIN: Configurable series of PoE-capable THT RJ45 jacks available in over 100 different versions!
Available in more than 100 different variants to match customer requests and application requirements, SUYIN’s robust, right-angled 8P8C RJ45 jack with the model designation 101113FS520M204ZA is designed for THT-processes.
IXYS Announces Landmark Qualification of its High Reliability Power Semiconductors into the New Japanese N700A Series of Shinkansen Bullet Trains
IXYS Corporation announced today the full qualification and first order series for its IXYS UK division for hermetic power semiconductor thyristors (SCR) and fast recovery diode capsules to be installed on Japan’s latest generation of Shinkansen bullet trains.
Infineon Introduces 650V Rapid 1 and Rapid 2 Families
Today at the Applied Power Electronics Conference & Exposition (APEC) 2013, Infineon Technologies introduced the highly efficient, fast recovery 650V 650V Rapid 1 and Rapid 2 silicon diode families. Combining Infineon’s ultrathin wafer manufacturing expertise for a low loss vertical structure plus unique cell design, the Rapid diodes provide outstanding performance.
Microsemi Adds Multiple New Devices to Non-Punch Through IGBT Product Family
Microsemi today announced the availability of more than a dozen new devices in its new generation of 1200 volt (V) non-punch through (NPT) IGBTs which include 25A, 50A and 70A current ratings. Microsemi's NPT IGBT product family is designed for a wide range of industrial applications requiring high power and high performance, with the newest devices well-suited for arc welders, solar inverters, and uninterruptible and switch mode power supplies.
TE Circuit Protection's SESD Product Family Now Qualified for Automotive Applications
TE Connectivity’s Circuit Protection business unit has announced that eight products in its SESD (Silicon ESD) series of passive circuit protection devices have now been AEC-Q101 qualified for use in automotive applications and specifically for in-vehicle infotainment systems. The SESD product family was originally released in February 2012, with AEC-Q101 testing completed in October 2012.
TI Announces Smart Bypass Diode With Industry's Lowest Power Dissipation
Texas Instruments introduce a smart bypass diode in a standard surface-mount package with 15-A current handling capability and the industry’s lowest power dissipation. In a typical application, each SM74611 lowers power dissipation by 80 percent and reduces the operating temperature inside the junction box by 50 degrees C when compared with a similar box using three conventional Schottky diodes.
Keithley Adds High Power Wafer-Level Testing To Automated Characterization Suite Software
Keithley Instruments has enhanced its Automated Characterization Suite software to support its expanding family of high power semiconductor characterization solutions. The ACS package is optimized for automated wafer-level parameter test applications, including automated characterization, reliability analysis, and known good die testing.