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Cree, Inc. will demonstrate the industry’s first GaN HEMT MMIC high power amplifier (HPA) for satellite communication applications at the 2011 IEEE International Microwave Symposium held June 7-9 in Baltimore. The demonstration product offers dramatic performance improvements over existing commercially-available GaAs MESFET transistors or Traveling Wave Tube-based amplifiers.

Marvell announced it has acquired the intellectual property and assets of Diseno de Sistemas en Silicio S.A. (DS2), a supplier of high speed semiconductor solutions for powerline communications. Powerline technology converts any existing electrical power wiring into an intelligent, high-speed networking medium, enabling consumers to quickly and affordably create a connected home that can stream virtually any personal or subscription-based digit...

GALEP-5 is a new, diminutive, palm-sized programmer with a 60,000 device output. Its high speed allows it to double as a fast production programmer in ganged arrays, while its JTAG debugging capabilities enable GALEP-5 to be used for microcontroller development.

Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that its multi award winning iineo platform will feature as part of the Future Proof Assembly Line at Booth N401 during NEW 2011, scheduled to take place 12-13 April 2011 in the NEC Pavilion, Birmingham, UK.

Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that the highly flexible, dual gantry IINEO II pick and place machine now provides unrivalled PCB dimensions and is capable of handling oversized PCBs up to 1610 x 600mm with a placement rate up to 27300 cph.

Yole Développement announces its report “III-V Epitaxy Equipment & Applications Market”. In this report, Yole Développement covers established and emerging epitaxy technology for III-V semiconductors used in several applications. It provides quantifications for tools and wafer starts per application, an in depth analysis of recent technology trends and their impact on cost of ownership and a comprehensive company profile of the main players...

Agilent Technologies Inc announces shipment of the latest release of its flagship RF and microwave design and simulation platform, Advanced Design System 2011. As the industry's most comprehensive multi-technology design platform, ADS 2011 represents a significant breakthrough in electronic design automation.

Intense Ltd., today announced at Photonics West the release of Hermes DDL, a turnkey Direct Diode Laser System. Powered by Intense's patented QWI enabled high temperature QCW stack technology, Hermes DDL is the company's first turnkey industrial laser system. It includes a compact, turnkey laser that comes fully integrated with drive electronics and optics capable of delivering up to 1.5kW of power at various programmable pulse lengths and duty c...

Now available at MSC Vertriebs GmbH: the DF59 multifunctional connector of Hirose, which is applicable for wire to board power supply connections and board to board ‘bridge’ connections. In addition a shortening plug version is available. Only one type of receptacle is needed, irrespective of whether the cable plug or board mount plug is used, allowing a reduction in the number of components needed.

AIXTRON SE has announced a large multiple order for the industry standard LED production platform AIX G5 HT MOCVD Planetary Reactor from Samsung LED.