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TactoTek, the global In-Mould Structural Electronics (IMSE) technology pioneer, has announced the completion of a $60 million funding round led by Nidoco AB, part of Virala Group. The financing attracted significant investments from a premier consortium of financial and strategic investors including Cornes Technologies, Elo Mutual Pension Insurance Company, European Investment Bank, Finnish Industry Investment Ltd, 3M Ventures, Ingman Group, VTT ...

Vishay has introduced a new 150 V TrenchFET Gen V n-channel power MOSFET in the PowerPAK SO-8S (QFN 6x5) package.

Donut Lab has developed an entirely new approach tobuilding electric vehicles. The company's development platform offers manufacturers a library of inter-compatible components that can be used to produce new electric vehicles such as supercars, buses, drones, or SUVs in record time.

Samtec, Inc.announces availability in production quantities of AcceleRate Slim Direct-Attach Cable Assemblies, the industry’s slimmest cable system.

Littelfuse, Inc. announced the expansion of its NanoT tactile switch product line. The series, featuring miniature, surface-mounted, waterproof tactile switches, now includes new operational force options and top- and side-actuated models, further enhancing its application innext-generation smart wearables, wireless headsets, portable medical devices, and IoT systems.

The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where optical andelectronic componentsare integrated in a common housing.

Würth Elektronik launch Daphnis-I on the market – a slim, ultra-low power consumption and long range radio module for IoT applications.

AI hardware startup GEMESYS has successfully raised €8.6 million in a pre-seed funding round led by the Amadeus APEX Technology Fund together with Atlantic Labs.

Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs for power conversion, has announced the opening of its North American Design and Development Center in Ottawa, Ontario, Canada.

To enable developers building artificial intelligence (AI)-driven sensor processing systems, Microchip Technology has released its PolarFire FPGA Ethernet Sensor Bridge that works with the NVIDIA Holoscan sensor processing platform.