Search results for "Qt group"
Series 15 – Episode 3 – 25 years of Pickering in PXI
Paige West speaks with Keith Moore, CEO, Pickering Group and Founder of Pickering Interfaces about 25 years of PXI.
Microsoft to build hyperscale datacentre in Leeds
Following a £106.6 million acquisition,Microsoft has plansto build a hyperscale datacentre on the site of a former power station in Leeds.
Cadence expands system IP portfolio
Cadence Design Systemshas expanded its system IP portfolio with the addition of the Cadence Janus Network-on-Chip (NoC).
LiDAR rides China's wave
The global automotive LiDAR market is projected to grow from $538 million in 2023 to $3,632 million by 2029, with a CAGR of 38% over this period.
Top 5 cables/connecting products in June
Electronic Specifier takes a look at the top 5 cables/connecting products to have been released in June 2024.
Pyroelectric DLaTGS detectors
LASER COMPONENTS has announced its range of pyroelectric DLaTGS detectors which are now available.
Six researchers shortlisted for £350k prize
Six esteemed researchers, who are at the forefront of developing the next generation of radar and microwave technologies, have been shortlisted for the Institution of Engineering and Technology’s (IET) prestigious £350,000 A F Harvey Engineering Research Prize.
Colour-coded single-position terminal blocks
CUI Devices’ Interconnect Group has announced a new range of single-position terminal blocks with blue, green, red, white, and yellow colour options that can be intermixed to create colour-coded wire connections.
NTT DATA and Zebra technologies device as a service collaboration
NTT DATA has announced a strategic partnership with Zebra Technologies to accelerate innovation in the 5G device ecosystem, laying the foundation for widespread adoption across industries.
Siemens introduces Innovator3D IC
Siemens Digital Industries Software announces Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D and 3D technologies and substrates in the world.