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An event that covers all aspects of open and disaggregated network technologies, Fyuz attracts C-Level executives, visionary speakers, innovators, and disruptors.

Semitech Semiconductor, an innovative provider of wireless and power line communication (PLC) solutions for smart grid, automotive, and industrial IoT applications, will be on hand atEnlit Europethis week to highlight how itsSM2400 PLC solutioncan be leveraged to address rising electricity costs – and accelerate the energy transition.

Indium Corporation’s Principal Engineer – Advanced Materials, Andy C. Mackie, PhD., will conduct a webinar on the rapid advancements taking place within e-mobility electronics technology.

Just over two fifths (43%) of businesses responding to a recent Zoho survey*, have called for the Government to increase funding for businesses developing AI technologies to promote innovation, as the UK seeks to establish itself as a global AI leader.

NEC has enhanced and expanded the performance of its lightweight large language model (LLM) and is scheduled to launch it in the spring of 2024.

SEMI, the industry association serving the global electronics design and manufacturing supply chain, has announced the election of two new members to the SEMI International Board: Kai Beckmann, Member of the Executive Board and CEO of the Electronics business sector of Merck KGaA, Darmstadt, Germany; and Benjamin Loh, Chair of the Management Board and President and CEO of ASM.

A new International Data Corporation (IDC) InfoBrief, sponsored by Mitek, Biometrics Key to Customer Satisfaction and Combating AI-Generated Fraud*, has been released.

SEMICON Japan opens 13th Dec. at Tokyo Big Sight with more than 900 exhibitors from 19 regions showcasing their latest products and technologies.

TouchNetix AS, a provider of human machine interface (HMI) semiconductor chips and sensor modules, announced the appointment of Gaute Myklebust as interim CEO.

Advantest Corporation announced two new products designed to deliver advanced handling capabilities essential for the fast-growing AI and high-performance computing (HPC) markets: the HA1200 die-level handler and the active thermal control (ATC) 2-kilowatt (kW) option for the M487x handler series.