Search results for "Master Bond"
Signal generation and analysis solutions at European Microwave Week 2023
Anritsu is attending the European Microwave Exhibition, showing its most advanced testing solutions for signal generation and signal analysis.
X-FAB and Soitec team up
X-FAB and Soitec are set to collaborate on offering Soitec’s SmartSiC wafers for the production of silicon carbide power devices at the former's facility in Lubbock, Texas.
X-FAB and Soitec team up to offer SmartSiC at Lubbock plant, USA
X-FAB (Euronext Paris), a global pure-play foundry pioneer serving a large variety of fabless customers, and Soitec (Euronext Paris), one of the leaders in designing and manufacturing innovative semiconductor materials, will begin work to offer Soitec’s SmartSiC wafers for the production of silicon carbide power devices at X-FAB’s plant in Lubbock, Texas.
Pilot factory for next-generation smart wearable patches
Wearable sensor patches are revolutionising healthcare and wellness applications by providing continuous monitoring with optimal comfort and reliability.
New data centre to boost North Lincolnshire job market
Plans for a new data centre in North Lincolnshire, set to create 400 jobs, have been submitted to North Lincolnshire Council.
KYZEN to showcase advanced packaging solutions at PCIM
KYZEN, a global specialist in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in PCIM Europe 2024, scheduled to take place 11–13 June 2024 in Nuremberg, Germany.
Indium experts will present at Electronics in Harsh Environments Conference
Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East at Indium Corporation, will deliver a technical presentation, while Dr. Ronald Lasky, Senior Technologist, will lead both a workshop and a technical presentation at the Electronics in Harsh Environments SMTA Conference from May 14 to 16 in Copenhagen, Denmark.
DELO offers a new adhesive for closed-cavity packaging
DELO has developed a new, reliable sealant adhesive for CMOS image sensors, which are often used in driver monitoring systems.
Anritsu to showcase AI RF sensing
Anritsu will attend EuMW together with its partner AnaPico, showing its most advanced testing RF solutions on booth 309C.
UMaine breaks record with new 3D printer
UMaine has surpassed its own 2019 Guinness World Record by unveiling a new polymer 3D printer, four times larger than its predecessor, aimed at propelling sustainable manufacturing across various industries.