Search results for "AMD"
Advantech: Demonstrating Edge AI for embedded technologies
Visitors to Embedded World 2023 will find Advantech in Hall 3, Booth 339, where they will see live demonstrations that show how to leverage the full advantages of AI at the Edge. Here, the Advantech AIR-030, an ultra-compact Edge AI system powered by the NVIDIA Jetson Orin module series, will take centre stage. The company will also shine the spotlight on a number of individual high-performance products for multi-stream Edge applications, includi...
Next-generation, high-performance network to enhance data-intensive science
AMD announced its collaboration with the Energy Sciences Network (ESnet) on the launch of ESnet6, the newest generation of the US Department of Energy’s (DOE’s) high-performance network dedicated to science.
China ramps up chip war with export controls on key materials
Chinahas announced a policy that will require companiesexporting key materialsused inchipsto obtainspecial licences.
SEMI 3D & Systems Summit 2023 opens with HI and SiP solutions
3D integration and systems for semiconductor manufacturing applications will take centre stage at SEMI 3D & Systems Summit as the event opens with experts sharing the latest developments and insights into the 3D roadmap, heterogeneous integration (HI) and system-in-package (SiP) technologies for smarter systems. Registration is open for the 26th – 28th June summit in Dresden, Germany.
Kontron to exhibit at embedded world
At the embedded world Exhibition & Conference from 14-16 March 2023 in Nuremberg,Kontron will showcase its latest products and smart IoT solutions with a new brand identity, marking the completion of the transformation process towards becoming a pure IoT and Industry 4.0 specialist.
RED Semiconductor adds David Harold to management team
RED Semiconductor (“RED”), a fabless semiconductor company, has added David Harold to the management team as Head of Business Development.
Making robots more efficient with adaptive computing
This article originally appeared in theAugust'22magazine issue of Electronic Specifier Design – see ES'sMagazine Archivesfor more featured publications. As roboticists encounter limitations imposed by traditional processor architectures, customisation and parallelism are needed to meet forthcoming performance, security, and safety challenges. Victor Mayoral-Vilches, former Systems Architect at Xilinx, AMD Consultant, and Founder of Acceler...
ASRock Industrial launches 4X4 BOX 7000/D5 Series
ASRock Industrial has announced the 4X4 BOX 7000/D5 Series Mini PCs powered by AMD Ryzen 7000U-Series APUs up to 8 Zen 3+ cores. Featuring maximum dual DDR5 4800MHz memory up to 64GB, the 4X4 BOX 7000/D5 Series aims to bring about performance enhancement. Now poised with enriched IOs and expansions, the Series also provide quad-display outputs of up to 8K outstanding graphics with one HDMI 2.1, three DisplayPort 1.4a, and five USB ports, includin...
Amdocs launches amAIz enterprise generative AI framework
Amdocs has announced Amdocs amAIz, a telco generative AI framework for enterprise applications.
Rutronik expands portfolio with latest X1, X2, and Y2 film capacitors
Rutronik expands its portfolio with the latest X1, X2, and Y2 film capacitors from Vishay Intertechnology.