Search results for "semiconductors"
NXP’s advanced Trimension UWB portfolio hits the road with Audi
NXP Semiconductors has announced that its Trimension NCJ29Dx family, part of one of the industry’s broadest UWB portfolios, is the technology foundation for Audi’s advanced new UWB platform, delivering the precise and secure real-time localisation required by leading premium car manufacturers to enable hands-free secure car access via smart mobile device and other UWB-based features.
NXP Ethernet switches enables vehicle networks
NXP Semiconductors has unveiled its new S32J series of high-performance Ethernet switches and network controllers.
Series 16 – Episode 1 – Building Germany's first quantum computer demonstrator
Paige West speaks with Christian Wiebus, Senior Director New Business and Innovation, NXP aboutthe company’s partnership with eleQtron and ParityQCto build the first quantum computer demonstrator made entirely in Germany.
Crossover MCU adds more punch for AI-Edge devices
NXP Semiconductors has unveiled its new i.MXRT700 crossover MCU family delivering higher performance and lower power consumption.
NXP addresses battery pack monitoring with new solution
The newly introduced NXP MC33777 is the world’s first battery junction box integrated circuit (IC) to incorporate sensing, processing, and actuation capabilities within a single device.
UWB device combines secure ranging and short-range radar
NXPSemiconductors has unveiled theTrimensionSR250, said to be the industry’s first single-chip solution that integrates on-chip processing capabilities with both short-range UWB radar and secure ranging.
NXP delivers customisation for payment cards with JCOP Pay
What’s new:NXP Semiconductorshas announced JCOP Pay operating on JCOP 5 EMV, designed to deliver a high degree of customer customisation of payment cards, while simultaneously enhancing their security. With the most recently obtained EMVCo certification, JCOP Pay operating on JCOP 5 EMV enables customers to achieve a long lifetime for card issuance.
Inova & Lextar sign MoU for ISELED and ILaS technology
Inova Semiconductors and Lextar have jointly announced that they signed a Memorandum of Understanding (MoU) where Inova is going to provide its ISELED and ILaS technology to Lextar.
NXP accelerates digital car keys with certification from Car Connectivity Consortium
NXPreceives a certification from the Car Connectivity Consortium, enhancing security, safety and ease of access through digital keys.
NXP and ZF collaborate on SiC-based traction inverters
NXP Semiconductors has announced a collaboration with ZF on next-generation SiC-based traction inverter solutions for EVs.
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