Search results for "photon chips"
Researchers develop world's first chip-based 3D printer
Imagine a portable 3D printer that could fit in the palm of your hand, enabling the rapid creation of customised, low-cost objects on the go.
Synopsys accelerates trillion parameter HPC & AI supercomputing chip designs
Synopsys, Inc. announced the industry's first complete PCIe 7.0 IP solution, consisting of a controller, IDE security module, PHY, and verification IP.
Lab-grown diamond proposes to heat up the quantum tech market
Material innovations underpin many of the exciting applications offered by emerging quantum technologies.
Imec demonstrates new die-to-wafer hybrid bonding
At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...
Graphene Flagship celebrates 2D materials project successes
The Graphene Flagship is hosting a symposium 11–12 June 2024 at the Town Hall Europe, Brussels, to celebrate the successes of its €20 million 2D Experimental Pilot Line (2D-EPL) project.
Future of photonics under spotlight at annual meeting
Industry leaders, researchers, and policymakers will gather to discuss the future of light technologies, focusing on technological sovereignty and the necessity for resilient supply chains in Europe, at this year's Photonics Partnership Annual Meeting.
Custom silicon chips for printed electronics material characterisation
How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures silicon substrates for this purpose.
£35 million boost for British semiconductor scientists
British semiconductor researchers and enterprises are set to gain significantly increased access to research funding, thanks to the UK's recent entry into the EU’s ‘Chips Joint Undertaking’ as part of Horizon Europe.
Cold spin-electronics for quantum technologies
The Fraunhofer IPMS, Dresden and the Max Planck Institute for Microstructure Physics, Halle, are collaborating on innovative spin-based memory and logic components that operate at low temperatures.
MIT alumni looking to reinvent how chips communicate
Lightmatter, a company founded by three MIT alumni, is reimagining the very essence of the microchip, transcending conventional reliance on electrical signals by integrating light, or photons, for data processing and communication.