Search results for "photon chips"

Wave Photonics, a deep tech startup based in Cambridge, secured £4.5M to advance on-chip photonics designs for quantum technologies, sensors, and data centre applications.

Imagine a portable 3D printer that could fit in the palm of your hand, enabling the rapid creation of customised, low-cost objects on the go.

Synopsys, Inc. announced the industry's first complete PCIe 7.0 IP solution, consisting of a controller, IDE security module, PHY, and verification IP.

Material innovations underpin many of the exciting applications offered by emerging quantum technologies.

At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...

The Graphene Flagship is hosting a symposium 11–12 June 2024 at the Town Hall Europe, Brussels, to celebrate the successes of its €20 million 2D Experimental Pilot Line (2D-EPL) project.

Industry leaders, researchers, and policymakers will gather to discuss the future of light technologies, focusing on technological sovereignty and the necessity for resilient supply chains in Europe, at this year's Photonics Partnership Annual Meeting.

How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures silicon substrates for this purpose.

Further to sureCore’s recent announcement about its launch of a range of cryogenic IP following the successful evaluation of test chips in both 180nm and 22nm process nodes, the company has revealed that it has teamed with packaging experts, Sarcina, who designed a custom package specifically for use at cryogenic temperatures.

Microchip has announfced the new family of ATA650x CAN FD System Basis Chips (SBCs) with a fully integrated high-speed CAN FD transceiver and a 5V Low-Drop Voltage Regulator (LDO) available in compact 8-, 10- and 14-pin space-saving packages.