Search results for "miniaturisation"
Hitachi High-Tech and University of Tokyo joint Laser-PEEM research
Hitachi High-Tech and The University of Tokyo (UTokyo) have been conducting joint research into practical applications of high-resolution Laser-PEEM developed by UTokyo in the semiconductor manufacturing process.
Engineering a ghost hunt this Halloween
Welcome to Halloween – the one night each year when the veil between the living and the dead is at its thinnest, and, as some would have it, spirits turn to electronics to make contact with the world of the living.
SEMICON Europa to explore advanced packaging and fab management
Semiconductor industry experts will convene at SEMICON Europa 2024,12–15 November 2024 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.
Silk’s surprising role in next-gen microelectronics
Silk has long been revered for its luxurious qualities and historical significance as a valuable commodity. Now, researchers are discovering new potential for silk inmicroelectronics, paving the way for advancements in computing and wearable technology.
Alps Alpine develops the smallest class TACT switch
Alps Alpine announces the launch of the world's smallest* class surface-mount type TACT Switch, the “SKUB Series.” At just 2.4 × 1.4 × 0.55 (W×D H), this switch achieves a smaller size than previous models, while maintaining the same tactile feel and durability.
Series 16 – Episode 2 – EEA Award winner discusses LDS technology and antenna design
Paige West speaks with Carmen Redondo, Director, Global Marketing Antennas, KYOCERA AVX aboutwinning the Electronics Excellence Awardand its UWB LDS Antenna – Tulip.
Will the brain-computer interface market thrive before Neuralink?
The headlines have been full of exciting announcements about new brain-computer interface technologies that can read our minds.
ROHM’s N-channel MOSFETs offer high mounting reliability
ROHM has launched a new range of N-channel MOSFETs, including the RF9x120BKFRA, RQ3xxx0BxFRA, and RD3x0xxBKHRB models,designed for automotive applicationsrequiring low ON-resistance.
PCIM Expo 2025 to be even bigger to meet demand
The growing demand for power electronics is increasing the need for information and dialog within the industry. As a key gathering for the power electronics sector, the PCIM Expo is thus expanding from four to six halls in 2025 to create even more space for development potential.
Breakthrough in semiconductor patterning
A newly developed block copolymer is set to push the boundaries of integration andminiaturisation in semiconductor manufacturing, according to scientists from Tokyo Institute of Technology (Tokyo Tech) and Tokyo Ohka Kogyo (TOK).