Search results for "material"

Nexeon marked a significant advancement with the commencement of construction on its inaugural commercial production plant.

How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures silicon substrates for this purpose.

A team led by Lawrence Berkeley National Laboratory (Berkeley Lab) has introduced a ‘supramolecular ink’ technology, poised to revolutionise the OLED (organic light-emitting diode) displays and electronic device markets.

Ventec has announced that its VT-901 polyimide material is now fully and exclusively qualified by ESA in ACB Belgium’s manufacture of High-Density Interconnect (HDI) PCBs.

At electronica 2024, Ignion used the event as the platform for OMNIA, the latest in its line of virtual antenna solutions.

Battery technology company Echion has secured £10 million investment from Barclays Sustainable Impact Capital and existing investor BGF.

Markus Fischer has been appointed to the Rohde & Schwarz Executive Board. as Chief Operating Office (COO). He was previously Executive Vice President Operations.

Infineon and Quantinuum have announced a strategic partnership to develop the future generation of ion traps.

Hexagon has announced a new battery cell design solution that combines Fraunhofer ITWM’s electro-chemical simulation technology with Hexagon’s multi-physics material simulation and metrology software to significantly accelerate new battery cell research and development programmes.

The Chromerics Division of Parker Hannifin Corporation has released THERM-A-FORM CIP 60, a high-performance cure-in-place material and thermal gap filler that offers 6.0 W/m-K thermal conductivity.