Search results for "chip capacitors"
310% loss reduction in piezoelectric IC conversion achieved
University of California San Diego and CEA-Leti scientists have developed a piezoelectric-based DC/DC converter that unifies all power switches onto a single chip to increase power density.
Imec introduces compact wireless powering technology
Imec has introduced an ultrasound-based proof-of-concept for wireless powering of implantable devices, at this week’s International Solid-State Circuits Conference (IEEE ISSCC 2024).
Empower introduces power delivery platform for AI needs
Empower Semiconductor has introduced the Crescendo vertical power delivery platform to meet the increasing power needs of AI and high-performance computing (HPC) applications.
Use an agile RF transceiver in an adaptive SDR communication system
Aerospace and defence (ADEF) system designers face unrelenting demand for lower power and more compact communications systems that are capable of an agile response to a dynamic signals environment.
Get ready for SEMICON Europa 2024
SEMICON Europa 2024 will gather industry experts November 12-15 at Messe München in Munich, Germany for insights into the latest innovations and trends in sustainability, mobility, healthcare, materials, packaging, fab management and workforce.
Gluespec announce new engineering resources
Gluespec has announced new resources for engineers looking for advanced materials.
TI to showcase sustainability and intelligence at electronica 2024
Texas Instruments (TI) will demonstrate new embedded processing and analog products for designing a more intelligent and sustainable future at electronica, Nov. 12-15 in Munich, Germany.
Engineering business leader to take over as President of the IET
Engineering business leader Warren East CBE has been appointed as the 143rd President of the Institution of Engineering and Technology (IET).
RNWA automotive grade thin film resistors for precision high power applications
For precision applications requiring surface mount chip resistors with high power demands, self-heating often leads to elevated circuit temperatures.
Synopsys and TSMC Pave the path for trillion-transistor AI and multi-die chip design
Synopsysannounces its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs.