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PICMG has announced the release of the COM-HPC 1.2 ‘Mini’ specification. Measuring just 95 x 70mm, COM-HPC Mini is nearly half the size of the next-smallest COM-HPC form factor and provides a cost-effective, lower power module for autonomous mobile robots, drones, mobile 5G test and measurement equipment, and other far Edge applications.

The expansion of 5G and AI technology, coupled with the increasingly diverse application scenarios of edge computing, have created an opportunity for the transformation of various vertical application markets.

ADLINK Technology will be at Embedded World to showcase its edge visualisation strategy and capabilities.

PICMG, a consortium for the development of open embedded computing specifications, announced that the COM Express 3.1 specification has been ratified to support high-speed serial interfaces such as PCIe Gen4 and USB4.

PICMG announces that the COM-HPC committee has finalized the pinout and dimension definitions for the COM-HPC Mini form factor in record time.

Electronic Specifier takes a look at the top 5 products launched at Embedded World in June 2022.

ADLINK Technology has introduced the world’s first 12th Gen Intel Core processor-based Computer-on-Modules (COMs), available in two form factors – COM-HPC Client Type and COM Express Type 6.

Foundries.io has announced it will be featured in a variety of live demonstrations throughout the Embedded World event and will showcase its use in a fleet of IoT devices - including the German-designed unu Scooter and the Tailos Robot Cleaner - in its own booth EW, 4-139.

ADLINK and Pixus Technologies build strategic partnership to develop highly integrated, SOSA-Aligned OpenVPX system solutions

ADLINK Technology has announced that it is the official edge computing sponsor of the Indy Autonomous Challenge: the first autonomous racecar competition at the Indianapolis Motor Speedway.