Search results for "Siemens Digital Industries"
Siemens advances 3D-IC adoption with Calibre 3DThermal
Siemens Digital Industries Software has introduced Calibre 3DThermal, innovative software for thermal analysis, verification, and debugging in 3D integrated circuits (3D-ICs).
Siemens introduces AI-powered suite
Siemens Digital Industries Software has announced the release of the Solido Simulation Suite software ("Solido Sim" software), an integrated suite of AI-enhanced SPICE, Fast SPICE, and mixed-signal simulators.
Siemens collaborates with Samsung Foundry
Siemens Digital Industries Software announced that, in collaboration with Samsung Foundry, it has developed new capabilities for manufacturing multi-die packaged designs at advanced nodes.
Siemens C++ coverage closure and property checking
Siemens Digital Industries Software has announced two breakthrough capabilities for high-level verification of C++ for hardware design: formal property checking and reachability coverage analysis.
Siemens simplifies development of AI accelerators
Siemens Digital Industries Software announced Catapult AI NN software for High-Level Synthesis (HLS) of neural network accelerators on Application-Specific Integrated Circuits (ASICs) and System-on-a-chip (SoCs).
Siemens delivers new Solido IP validation suite
Siemens Digital Industries Software has introduced Solido IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories, and IP blocks.
Siemens collaborates with TSMC on design tool certifications
Siemens collaborates with TSMC on design tool certifications for the foundry’s newest processes and other enablement milestones.
First pre-silicon simulation environment for Arm Cortex-A720AE for software defined vehicles
Siemens Digital Industries Software is advancing its hardware-assisted verification portfolio with the introduction of PAVE360 software, a solution for Software Defined Vehicles (SDV) that facilitates accelerated pre-silicon development in the Cloud.
nepes picks Siemens to meet 3D IC package challenges
Siemens Digital Industries Software has announced that South Korea-based nepes corporation, which delivers Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D IC packages.
Siemens product trio targets emulation and prototyping
Siemens Digital Industries Software launched today (February 20) the Veloce CS hardware-assisted verification and validation system.