Search results for "SEMICON Europa"

Junkosha has chosen SEMICON Europa to announce the launch of its EPTFE Flat Cable designed for critical components inmanufacturing and inspection equipment.

Digital technologies enable companies to effectively address sustainability goals. Even though there are some considerable differences in the acceptance and usage intensity of the smart home and smart mobility, consumers in Europe, the US, and Asia see similarly high potential for climate protection through digital technologies.

DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: with the use of UV-curable moulding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimises the energy consumption.

First held in 1964, electronica was Germany’s first trade fair dedicated entirely to electronic components.

Agileo Automation launched the E84 PIO Box at Booth #C2848 atSEMICON Europa.

Semicon Europa 2023 opens tomorrow, bringing together industry experts from the electronics design and manufacturing supply chain.

Themed Shaping a Sustainable $1 Trillion Era, SEMICON Europa 2023 will gather industry experts 14—17 November 2023 at Messe München in Munich, Germany for insights into the latest trends and innovations in sustainability, mobility, healthcare, materials, packaging, fab management, and workforce development.

Adaptsys has formed a strategic partnership with APP System Services, bringing its innovative Re-flex II inline carrier tape forming technology to customers in Singapore.

Cinch Connectivity Solutions now offers its first commercial, off-the-shelf space-grade cable assemblies. Manufactured in the USA, the Semflex Space Qualified Cable Assemblies are constructed with rugged stainless steel to support a wide range of communication applications in harsh environments.

Advantest has announced the T5801 ultra-high-speed DRAM test system. The platform is engineered to support the latest advancements in high-speed memory technologies – including GDDR7, LPDDR6, and DDR6 – critical to meeting the growing demands of artificial intelligence (AI), high-performance computing (HPC), and edge applications.