Search results for "Indium Corporation"
Indium Corporation’s new type 6 jetting solder paste
Indium Corporation has introduced a new jetting solder paste to join its PicoShot series of products.
Indium expert to present at HiTEN conference
Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN 2024), taking place 15–17 July 2024 in Edinburgh, Scotland, UK.
Indium Corporation to give three talks at APEC 2024
Indium Corporation is set to present three insightful contributions at APEC 2024, taking place from 25-29 February in Long Beach, CA. These presentations, delivered by distinguished members of the Indium Corporation team, will delve into various aspects of the power electronics assembly industry.
Indium introduces alloy for solder paste
Indium is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.
Indium Corporation to present advanced materials at APEC 2024
At the upcoming APEC 2024, taking place from 25-29 February in Long Beach, California, Indium Corporation is set to exhibit a range of its high-reliability materials designed for automotive and power electronics applications, including those used in electric vehicle manufacturing.
Indium to present on alternative solder alloys at SMTA
Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on 16thMay 2024 in Aurora, Colorado.
Indium experts will present at Electronics in Harsh Environments Conference
Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East at Indium Corporation, will deliver a technical presentation, while Dr. Ronald Lasky, Senior Technologist, will lead both a workshop and a technical presentation at the Electronics in Harsh Environments SMTA Conference from May 14 to 16 in Copenhagen, Denmark.
Indium Corporation power electronics at NEPCON Japan
Indium Corporation will showcase its advanced assembly materials for power electronics, including the rapidly evolving EV manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan.
Indium expert to discuss Pb-free solder for power applications
Indium Corporation Product Manager – Semiconductor, Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held 8–9 May 2024 in Woburn, Massachusetts, USA.
Indium Corporation to showcase preforms at SPIE Photonics West
Indium Corporation will showcase its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, taking place from January 27thFebruary 1stin San Francisco.