Search results for "CU Phosco"

MacDermid Alpha Electronics Solutions, a pioneering supplier of integrated materials and chemistries to the electronics industry, is participating at the IMAPS 20th Annual Device Packaging Conference, Arizona 18–21 March 2024.

Engineers from Korea and the United States have taken a significant step towards integrating human capabilities with robotic exoskeletons, developing a wearable technology that could pave the way for advancements reminiscent of Iron Man. This innovative technology, encapsulated in a stretchable microneedle adhesive patch (SNAP), is designed to enhance the interaction between humans and robotic systems, potentially revolutionising health diagnosti...

The London Climate Technology Show 2024 is just five days away, as industry experts, business leaders, and influential decision-makers converge at ExCel London to chart the course towards a net-zero future.

NXP’s new MIFARE DUOX is the first contactless NFC IC in its class to combine asymmetric and symmetric cryptography in a single chip, enabling simplified key management and fast asymmetric authentication for EV charging authentication, secure car access, and other access management applications.

u-blox, a global provider of positioning and wireless communication technologies, has launched the SARA-R10001DE, a LTE Cat 1bis module featuring an embedded eSIM with Wireless Logic connectivity designed to improve the robustness, reliability, and resilience of IoT applications.

Renishaw recently hosted a special event at its Miskin manufacturing facility in South Wales, celebrating the intersection of cutting-edge additive manufacturing (AM) technology and high-performance sports.

In many industrial applications, it is important to precisely monitor the constant flow of liquids. Undesired air bubbles in the liquid stream are problematic because they can negatively influence processes or cause damage. EBE sensors + motion offers a new solution for this with the capaTEC technology.

Vishay has introduced a new 150 V TrenchFET Gen V n-channel power MOSFET in the PowerPAK SO-8S (QFN 6x5) package.

At electronica 2024, Ignion used the event as the platform for OMNIA, the latest in its line of virtual antenna solutions.

TactoTek, the global In-Mould Structural Electronics (IMSE) technology pioneer, has announced the completion of a $60 million funding round led by Nidoco AB, part of Virala Group. The financing attracted significant investments from a premier consortium of financial and strategic investors including Cornes Technologies, Elo Mutual Pension Insurance Company, European Investment Bank, Finnish Industry Investment Ltd, 3M Ventures, Ingman Group, VTT ...