Search results for "pcb"

WIN Semiconductorshas announced the beta release of its moisture-resistant 0.1µm pHEMT technology, PP10-29.

Schaffner has announced the launch of a new common mode choke for industrial applications which delivers higher performance than previous versions while retaining the same mechanical volume.

STMicroelectronics has commenced production of automotive high-side power switches featuring proprietary intelligent fuse protection and a Serial Peripheral Interface (SPI) for diagnostic data, enhancing resilience, and functional safety.

Indium is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.

At PCIM 2024, Electronic Specifier spoke with Cambridge GaN Devices’ (CGD) Peter Di Maso, VP of Business Development AMER at CGD, at their booth to learn more about CGD’s latest endeavours in the high power GaN space and its vision moving forward.

New families of silicon carbide (SiC) MOSFETs and Schottky Barrier Diodes (SBDs) in TSPAK packaging are being premiered by WeEn Semiconductors at PCIM Europe in Nuremberg (June 11-13).

Power Integrations has enhanced its hardware-software bundle for brushless DC motors (BLDC) with the introduction of BridgeSwitch-2.

Cambridge GaN Devices (CGD) has launched its lowest ever on-resistance (RDS(on)) parts.

Transitioning to a new vapor degreasing fluid is no small feat for PCB manufacturers, especially those who have been using a long relied on, established fluid to meet their stringent cleanliness standards. Elizabeth Norwood, Senior Chemist at MicroCare, LLC, further discusses.

Alpha and Omega Semiconductor Limited (AOS) announce the expansion of its package portfolio options for the second generation 650 to 1200V αSiC MOSFETs.