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Infineon and Semikron Danfoss sign supply agreement for electromobility chips
Cars with fully or partially electrified drivetrains will account for two thirds of cars produced by 2028, as per analyst forecasts. This rapid growth of electromobility is driving the demand for power semiconductors.
MathWorks package automates code generation to Qualcomm Hexagon NPU
MathWorks, the developer of mathematical computing software, announces the availability of a hardware support package for the Qualcomm Hexagon Neural Processing Unit (NPU), the technology embedded within the Snapdragon family of processors.
DELO carries out studies on miniLED dice
DELO has carried out internal feasibility studies, demonstrating the successful electrical and mechanical bonding of miniLED dice using directional conductive adhesives.
PCIM Asia 2024 concludes its most expansive event to date
PCIM Asia2024, Asia’s leading international platform for communication and exchange in power electronics, intelligent motion, renewable energy and energy management, concluded on 30th August 2024 at the Shenzhen World Exhibition and Convention Centre in China.
SEMI announces the MEMS & Sensors Executive Congress 2024
Industry visionaries and experts will gather October 7-9 at the MEMS & Sensors Executive Congress (MSEC 2024) at the Château-Bromont Hotel in Bromont, Quebec, Canada for insights into the latest trends and innovations in sensorisation.
PCIM Asia 2024 opens in Shenzhen 28th August
PCIM Asia 2024 will open its doors from 28 – 30 August at the Shenzhen World Exhibition and Convention Centre.
Panellists announced for electronica Women in Tech forum
Electronic Specifier has partnered withWomen in Electronicsto launch a dedicatedWomen in Tech forum at electronica 2024.
Infineon extends its Edge AI capabilities
Infineon has announced it is teaming with Edge Impulse to extend its Tiny Machine Learning-based AI development tools for the PSoC 63 Bluetooth LE microcontroller (MCU).
PCIM Asia Conference’s 2024 keynote headlines
The PCIM Asia Conference is set to return to Shenzhen from 28 – 30 August 2024 with this year’s programme headlined by three keynotes exploring emerging trends in power semiconductor technologies, developments in solid-state transformers, and the applications of power semiconductors in renewable energy and electrification.
XENSIV tyre pressure sensor with intelligent features
Infineon Technologies AG combines its automotive expertise with its patented glass-silicon-glass MEMS sensor for the automotive tyre pressure monitoring system (TPMS) market to launch the XENSIV SP49 tyre pressure monitoring sensor.