Search results for "green circuits"
Siemens simplifies development of AI accelerators
Siemens Digital Industries Software announced Catapult AI NN software for High-Level Synthesis (HLS) of neural network accelerators on Application-Specific Integrated Circuits (ASICs) and System-on-a-chip (SoCs).
Ansible Motion’s simulator selected to boost Formula E team
Penske Autosport is the latest professional motorsport team to add Ansible Motion’s Delta S3 Driver-in-the-Loop (DIL) simulator to its arsenal, as the team mounts its title challenge in the 2024 FIA ABB Formula E Championship.
New independent Institute to steer UK semiconductor innovation
A new independent UK Semiconductor Institute will, for the first time, bring together the government, universities, and the private sector to support key components of the government’s Semiconductor Strategy to grow the sector, which is backed by £1billion.
Indium Corporation sustainability focus at PCIM
Indium Corporation will showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.
Broadcom products enable green energy applications
As an industry leader in fibre optics and optocouplers, Broadcom is showcasing:
SEMI University: fast-track semiconductor skills development
Aiming to help the global semiconductor industry address its talent gap by training and upskilling workers, SEMI has announced that its SEMI University learning platform now offers online course certification programmes designed to fast-track semiconductor career development.
Luminus’ new RGBL colour-mix LED technology
Luminus Devices has introduced a series of 4-in-1 RGBL (Red-Green-Blue-Lime) LEDs designed for stage and architectural lighting systems that require high high-output colour mixing with high colour-rendering index (CRI).
ASMC 2024 opens with AI, smart manufacturing, and sustainability in focus
The 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024) opens with a focus on critical topics ranging from yield management and metrology to new developments in AI, smart manufacturing, and sustainability.
What is fan out wafer level packaging?
Fan out wafer level packaging (FOWLP) is an advanced semiconductor technology designed to enhance performance and miniaturise electronic devices.
Indium experts will present at Electronics in Harsh Environments Conference
Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East at Indium Corporation, will deliver a technical presentation, while Dr. Ronald Lasky, Senior Technologist, will lead both a workshop and a technical presentation at the Electronics in Harsh Environments SMTA Conference from May 14 to 16 in Copenhagen, Denmark.