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IC Insights recently released its Global Wafer Capacity 2019-2023 report that provides in-depth analyses and forecasts of IC industry capacity by wafer size, by process geometry, by region, and by product type through 2023.

A new semiconductor process combines lower leakage with low standby current modes, writes Graeme Clark, Renesas Electronics Europe

The IC industry has been on a mission to pare down older capacity (≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. In its recently released Global Wafer Capacity 2019-2023 report, IC Insights shows that due to the surge of merger and acquisition activity in the middle of this decade and with more companies producing IC devices on sub-20nm process technology, suppliers are eliminating inefficient wafer fabs.

In a recently released report from, IC Insights, entitled: ‘Global Wafer Capacity 2019-2023’, the company provides in-depth detail, analyses, and forecasts for IC industry capacity by wafer size, process geometry, region, and product type through 2023. The graph below shows the worlds installed monthly wafer production capacity by geographic region (or country) as of December 2018.

Research and innovation hub in nanoelectronics, energy and digital technologies, imec, along with EnergyVille have presented a new simulation framework that can reportedly accurately calculate the energy yield of bifacial PV systems (also capturing reflected light from the ground).

It has been announced that Theorem’s V21.4 JT to CATIA Composer, from the Publish 3D range of products, is now available with new and improved product features and enhancements for the CATIA Composer user needing to work with JT data. This latest release supports CATIA Composer 2019 and JT 10.

Automotive turbochargers use the exhaust gases to drive a turbine, which leads to more fuel burning as the air compressor pushes extra oxygen or air into the cylinder. Automotive turbochargers help in achieving better fuel efficiency by increasing the pressure of the air coming in the engine.

Many machines are completely reliant upon chains for their operation, so it makes sense to use the best chain possible and to get specialist advice when specifying a new or replacement chain. Here, Derek Mack, UK Sales Director for Tsubaki explains how a custom solution will often provide the best fit and deliver total cost of ownership savings.

Electronic Specifier has recently been in discussion with Anritsuabout the company’snew developments dedicated to the automotive market. Among them are fixed attenuators, power splitters, dividers, directional couplers, and spectrum analysers.

A new product series of robust board-to-board connectors has been introduced by Phoenix Contact. For the market launch, the Fine Pitch series includes shielded connectors with a pitch of 0.8mm and unshielded versions with a pitch of 1.27mm. The newly developed product series offers versatile solutions for the connection of several PCBs within the device.