Search results for "NEC corporation"
TDK presents new dual-die stray-field robust 3D position sensor
TDK Corporation is expanding its Micronas 3D HAL position sensor portfolio with the introduction of the HAR 3920-2100, a dual-die sensor tailored for automotive and industrial use.
Indium Corporation celebrates 90 years of materials science innovation
Indium Corporation, a global pioneer in materials science and electronics assembly solutions, commemorates its 90th anniversary on 13 March 2024.
Avfuel and Neste ink extension of SAF supply agreement
Avfuel Corporation and Neste finalised a partnership extension that keeps the companies at the forefront of sustainable aviation fuel (SAF) supply for business aviation.
Data I/O to showcase at IPC APEX Expo 2024
Data I/O will showcase device programming and security provisioning solutions at IPC APEX Expo 2024.
Ultra-sensitive graphene sensor could improve water quality monitoring
Engineers at the University of California San Diego have crafted an ultra-sensitive sensor from graphene capable of detecting lead ions at concentrations previously undetectable by current technologies.
Encompass celebrates IWD by spotlighting female leaders
Encompass Corporation, the global provider of real-time digital Know Your Customer (KYC) profiles, is celebrating International Women’s Day (IWD) by spotlighting senior women within the technology space, marking this year’s ‘Inspire Inclusion’ theme.
nepes picks Siemens to meet 3D IC package challenges
Siemens Digital Industries Software has announced that South Korea-based nepes corporation, which delivers Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D IC packages.
Renesas’ processor roadmap for next-gen automotive SoCs and MCUs
Renesas Electronics Corporation recently unveiled its strategy for the forthcoming generation of system on chips (SoCs) and microcontrollers (MCUs), aimed at a broad spectrum of automotive digital applications.
Indium to feature Durafuse solder technology
Indium Corporation features its innovative Durafuse solder technology alongside its Rel-ionportfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, 9–11 April 2024, in Anaheim, California, US.
Microprocessor market size worth $142 billion in 2032
Theglobal microprocessor industry is experiencing rapid growthand serves a vital function in various sectors such as consumer electronics, automotive, healthcare, and telecommunications.