Search results for "NEC Corporation"

Engineers at the University of California San Diego have crafted an ultra-sensitive sensor from graphene capable of detecting lead ions at concentrations previously undetectable by current technologies.

Encompass Corporation, the global provider of real-time digital Know Your Customer (KYC) profiles, is celebrating International Women’s Day (IWD) by spotlighting senior women within the technology space, marking this year’s ‘Inspire Inclusion’ theme.

Siemens Digital Industries Software has announced that South Korea-based nepes corporation, which delivers Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D IC packages.

Renesas Electronics Corporation recently unveiled its strategy for the forthcoming generation of system on chips (SoCs) and microcontrollers (MCUs), aimed at a broad spectrum of automotive digital applications.

Indium Corporation features its innovative Durafuse solder technology alongside its Rel-ionportfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, 9–11 April 2024, in Anaheim, California, US.

Theglobal microprocessor industry is experiencing rapid growthand serves a vital function in various sectors such as consumer electronics, automotive, healthcare, and telecommunications.

KYZEN are to exhibit at the SMTA Dallas Expo and Tech Forum, scheduled to take place 19th March 2024 at Plano Event Centre in Plano, TX.

As part of the "Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems" under the New Energy and Industrial Technology Development Organisation (NEDO), NEC Corporation (NEC) and Fujitsu Limited (Fujitsu) are conducting research and development of a technology for testing the interoperability of post-5G base stations compliant with O-RAN specifications.

Indium Corporationwill feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 20th International Conference and Exhibition on Device Packaginghosted by IMAPS, 18–21 March 2024, in Fountain Hills, AZ.

ABLIC, a Japanese analog semiconductor specialist, is at the forefront of innovating battery-less sensors that harness previously untapped environmental energy.