Search results for "Master Bond"
SPX CommTech launches transportable tactical COMINT 953 RF receiver
SPX CommTech, formed byTCIandECS, launches its next generation 953 Communications Intelligence (COMINT) Radio Frequency (RF) Receiver for identification, direction-finding, and tracking of hostile RF signals to support COMINT and Counter-UAS tactical operations.
Autonomous shuttle pilot project at UNC Charlotte
Beep Inc. announced a second project with the North Carolina Department of Transportation (NCDOT) as part of its Connected Autonomous Shuttle Supporting Innovation (CASSI) programme.
Weald Electronics’ connectors meet MIL-DTL-26482 requirements
Weald Electronics, a major UK manufacturer of electrical connectors and accessories, offers a wide range of connectors for demanding environments including defence equipment, avionics, marine and naval equipment, medical systems, industrial automation, machine building, test and measurement, high performance communications systems, and instrumentation.
Government tech tsar warns of AI cyber threat to NHS
Ian Hogarth, the government’s new AI tsar, has warned that artificial intelligence could be used by cyber criminals to attack NHS.
Display solutions from Review Display Systems
RDS offer a wide range of display technologies and support peripherals which include standard and high brightness TFT modules, e-Paper displays, OLED displays, capacitive and resistive touch solutions and optical bonding. Our experienced engineers are able to advise the best choice of display technology for specific application needs, whether it be sunlight readability, wide temperature range, outdoor use, or low power operation.
The importance of rework cleaning in electronic manufacturing
The world of electronics manufacturing is evolving rapidly, with electronic components becoming increasingly smaller and more densely packed. As this trend continues, thorough rework cleaning after a PCB (printed circuit board) rework becomes crucial to ensure the quality, reliability, and performance of electronic assemblies.
Mouser introduces Banner Engineering’s R130C IO-Link Hub
Mouser Electronics, the authorised global distributor of the newest electronic components and industrial automation products, is now shipping the R130C discrete IO-Link hub from Banner Engineering.
Flip-chip die bonder from ITEC
ITEC has introduced the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines, attaching up to 60,000 flip-chip dies per hour.
What is being developed with quantum computers today?
The risk of missing out on the competitive advantage quantum computing offers is rising. Governments and private investors worldwide are placing multi-billion-dollar bets that the industry will produce huge long-term returns. Yet, for this to be realised, the theoretical advantage of quantum computers must be translated into real-world commercial value. In this article,IDTechEx explores which applications are being developed across the materials,...
Effective cooling of hot spots with liquid-cooled heat sinks
Liquid-cooled heat sinks are used in applications where passive or fan-based cooling solutions are insufficient, but effective cooling is indispensable.