Search results for "ASIC"

Last year, Sondrel launched its Architecting the Future series covering the SFA 100 to the SFA 350A. These pre-packaged, System on chip IP architectures provide a fast track for designing a new chip as all that is needed is to select the most suitable foundry and process, third-party IP and to integrate any of the customer’s own IP to create a custom solution.

When developing an application specific integrated circuit (ASIC) with a supplier, nothing is manufactured or physically measured before the end of the entire design process. So, how can you ensure that the finished product will fit seamlessly into your application without any unpleasant surprises?

AMD announced that the AMD Xilinx Automotive (XA) Zynq UltraScale+ MPSoC platform has been selected to power the Aisin automated parking assist (APA) system.

The COVID pandemic highlighted the precarious nature of the electronics industry chain as supply shortages have caused delays in all mark sectors.

AMD has announced it has completed Class B qualification for the company’s first space-grade Versal adaptive SoCs.

Advantest has selected the R&S RTP high-performance oscilloscope for mass production evaluation of high-speed SoC testers.

Farnell is stocking the new Rohde & Schwarz (R&S) MXO 4 Series, the first in the next generation of oscilloscopes.

Industry 4.0 technologies have transformed processes across the manufacturing value chain for the better, but ensuring worker safety in an increasingly more complex environment has taken on a different form, with new considerations.

The dimension of digitalisation is enormous and global data volumes will only multiply exponentially in the future with video streaming, virtual conferences, cloud services, cryptocurrencies and many other digital applications.

RFX Group, incorporating Laptech Precision, has launched a micro miniature ceramic packaged crystal with a footprint of just 2.05 x 1.65mm and a height of only 0.45mm.