Search results for "STMicroelectronics "
Synopsys Collaborates With STMicroelectronics to Help Achieve Critical Milestone in 20-nm Design
Synopsys announced its close cooperation with STMicroelectronics (ST) in the successful tapeout of ST's first 20-nanometer (nm) technology demonstrator test chip. This tapeout represents a critical milestone in the R&D collaboration between the two companies to develop a comprehensive design enablement solution for system-on-chip (SoC) integrated circuits (ICs) using ST's next-generation 20-nm process technology, co-developed with its ISDA (Inter...
Synopsys Expands EDA's Largest Users Group to Include Conferences in Ottawa and Austin
Synopsys recently expanded the SNUG program to include events in Ottawa and Austin, making the conferences more accessible and relevant to a greater number of its customers. Bringing SNUG to the backyards of additional customers underscores the value that Synopsys sees in these popular gatherings, and the strong attendance numbers and enthusiastic participation confirm that users also find value in participating in these live events, says Al Czam...
Synopsys Collaborates with Industry Consortium on Solutions to Model Latest 28-nm Parasitic Effects
Synopsys announced new extensions to its open source-licensed Interconnect Technology Format (ITF) which enables modeling of more complex device structures and interconnect layers for parasitic extraction tools at 28-nanometer (nm) and below process technologies. Synopsys collaborated with the members of the Interconnect Modeling Technical Advisory Board (IMTAB) of the IEEE Industry Standards and Technology Organization (IEEE-ISTO) to define th...
Synopsys Hosts Special Events with Industry Leaders at DAC 2012
Synopsys, Inc. will host several special events at the Design Automation Conference, June 3 - 7 in San Francisco, California. The events will feature speakers from leading semiconductor companies, IP providers, foundries and Synopsys.
Development kit for STM32 Connectivity Line
Hitex has introduced the STM32-comStick designed for an easy and low-cost start in STMicroelectronics’ new Cortex-M3-based STM32 Connectivity Line. The STM32-comStick is a complete small-sized development kit that provides a comprehensive entry to the STM32 Connectivity Line’s features.
Altium annonce Altium Designer 12
Altium, l'éditeur de logiciels et de services de conception électronique de prochaine génération, annonce Altium Designer 12, dernière mouture de la fameuse solution de conception électronique unifiée, Altium Designer. Altium Designer 12 est dévoilé dans le cadre d'Embedded World, à Nuremberg, en Allemagne, un an après le lancement initial d' AltiumLive et d'une nouvelle plate-forme Altium Designer 10.
NEC Electronics and Toshiba Extend Chip Technology Development Agreements with IBM
IBM Corporation, NEC Electronics Corporation and Toshiba Corporation announced that NEC Electronics and Toshiba have extended technology development agreements with IBM to participate in the development of a 28-nanometer (nm), high-k metal gate (HKMG), low-power chip technology geared for consumer products.
Express Logic and Blue Water Embedded Bring PrismX GUI Toolkit to STM32 Platform PrismX demo available online and live at Embedded World 2011: Hall 11-124
Express Logic and Blue Water Embedded, a leading supplier of graphics software for embedded systems, today announced the availability of the PrismX™ graphics toolkit for the STMicroelectronics STM32 processor family. PrismX, a complete GUI software development solution for resource-constrained devices such as STMicroelectronics Cortex-M3-based STM32, delivers the eye-catching graphical capabilities and time-to-market edge needed for medical, in...
Agilent Technologies Names Didier Hirsch Senior Vice President and CFO
Agilent announced that Didier Hirsch, acting chief financial officer and vice president, corporate controllership and tax, has been appointed senior vice president and chief financial officer, effective today. Hirsch has been acting CFO since April 1, 2010.
Semiconductor Industry Leaders Form DA5 Consortium to Explore Lead-Free Solutions
Bosch (Division Automotive Electronics), Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics today announced that they have formed a consortium to jointly investigate and standardize the acceptance of alternatives for high-lead solder for attaching die to semiconductor packages during manufacturing. The five company consortium is known as the DA5 (Die Attach 5).