Search results for "STMicroelectronics"
Altium annonce Altium Designer 12
Altium, l'éditeur de logiciels et de services de conception électronique de prochaine génération, annonce Altium Designer 12, dernière mouture de la fameuse solution de conception électronique unifiée, Altium Designer. Altium Designer 12 est dévoilé dans le cadre d'Embedded World, à Nuremberg, en Allemagne, un an après le lancement initial d' AltiumLive et d'une nouvelle plate-forme Altium Designer 10.
NEC Electronics and Toshiba Extend Chip Technology Development Agreements with IBM
IBM Corporation, NEC Electronics Corporation and Toshiba Corporation announced that NEC Electronics and Toshiba have extended technology development agreements with IBM to participate in the development of a 28-nanometer (nm), high-k metal gate (HKMG), low-power chip technology geared for consumer products.
Express Logic and Blue Water Embedded Bring PrismX GUI Toolkit to STM32 Platform PrismX demo available online and live at Embedded World 2011: Hall 11-124
Express Logic and Blue Water Embedded, a leading supplier of graphics software for embedded systems, today announced the availability of the PrismX™ graphics toolkit for the STMicroelectronics STM32 processor family. PrismX, a complete GUI software development solution for resource-constrained devices such as STMicroelectronics Cortex-M3-based STM32, delivers the eye-catching graphical capabilities and time-to-market edge needed for medical, in...
Agilent Technologies Names Didier Hirsch Senior Vice President and CFO
Agilent announced that Didier Hirsch, acting chief financial officer and vice president, corporate controllership and tax, has been appointed senior vice president and chief financial officer, effective today. Hirsch has been acting CFO since April 1, 2010.
Semiconductor Industry Leaders Form DA5 Consortium to Explore Lead-Free Solutions
Bosch (Division Automotive Electronics), Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics today announced that they have formed a consortium to jointly investigate and standardize the acceptance of alternatives for high-lead solder for attaching die to semiconductor packages during manufacturing. The five company consortium is known as the DA5 (Die Attach 5).
Synopsys Unveils DC Explorer for Early RTL Exploration
Synopsys today introduced DC Explorer, the latest addition to the Galaxy Implementation platform, to significantly speed up development of high-quality design data. To meet aggressive schedules for today's massively integrated, multimillion-instance, Gigascale designs, engineers need an RTL exploration solution that enables them to quickly and efficiently perform what/if analyses of various design configurations – even before the design data is...
Synopsys and IEEE-ISTO launch industry body to evolve Interconnect Modeling Standard
Synopsys, Inc. today announced the open source availability of its widely used Interconnect Technology Format (ITF) for parasitic modeling and the formation of a technical advisory board (TAB) under the auspices of IEEE Industry Standards and Technology Organization (IEEE-ISTO). The purpose of the Interconnect Modeling TAB (IMTAB) is to facilitate the evolution of ITF and promote an interoperable interconnect modeling format to address the indust...
Synopsys Expands Synthesis-Based Test Technology to Increase Designer Productivity
Synopsys announced plans to expand test technology embedded in Synopsys' RTL synthesis to address the need for higher defect coverage, lower test cost and faster yield analysis while simultaneously minimizing the impact on design goals and project schedules. Design teams currently using Synopsys' RTL synthesis and test solution are able to quickly implement compression to lower digital logic test costs, handle pin-limited test methodologies and e...
Synopsys and Xilinx Collaborate on the Industry's First Methodology Manual for FPGA-Based Prototyping of SoC Designs
Synopsys, Inc. and Xilinx, Inc. today announced the availability of the FPGA-Based Prototyping Methodology Manual (FPMM), a practical guide to using FPGAs as a platform for system-on-chip (SoC) development. The FPMM captures valuable design and verification expertise contributed by engineering teams from BBC Research & Development; Design of System on Silicon, S.A. (DS2); Freescale Semiconductor; LSI, Inc.; NVIDIA Corp.; STMicroelectronics; and T...
Infineon introduces new ThinPAK 8x8 leadless SMD package for HV Power MOSFETs designed to enable higher power density solutions
Infineon Technologies today introduces the ThinPAK 8x8, a new leadless SMD package for HV MOSFETs. The new package has a very small footprint of only 64mm² (vs. 150mm² for the D2PAK) and a very low profile with only 1mm height (vs. 4.4mm for the D2PAK). The significantly smaller package size, combined with benchmark low parasitic inductances, provides designers with a new and effective way to decrease system solution size in power density drive...