Search results for "same sky"

What will the E/E (electrical/electronic) architecture in thevehicle of tomorrowlook like? And what requirements will this place on thesemiconductorsused?

Technological, environmental, and economic factors all play a role in whyelectric vehicles (EVs)have become a prominent topic insustainabilityin recent years.

Officials from the US Department of Energy visited a UK facility that is advancing the application of technology to make nuclear decommissioning safer, quicker, and more cost-effective.

OnVolvo Cars’Capital Markets Day, held in Gothenburg, Sweden, the company will reveal its new approach to technology.

TiniFiber, the exclusive manufacturer of US patented and UL-listed TiniFiber Micro Armor Fiber optical cabling solutions, is to demonstrate its Micro Armor Fiber optic cable to a European audience for the first time, when it attends the ECOC 2024 optical communication tradeshow.

The European Processor Initiative (EPI), a project with 27 partners from 10 European countries, with the goal of helping to achieve EU independence in HPC chip technologies and HPC infrastructure has announced the first EPI Forum to be held in Barcelona, Spain, October 9-10, 2024.

The electric vehicle (EV) industry has been dealt another blow, as car manufacturer Volvo has slashed its target of making solely EVs by 2030, as it said some vehicles by that date will be hybrid, too.

Amphenol RFis pleased to announce the expansion of its non-magnetic offerings with new SMPMPCB designs.

Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometres are used to create tinyelectrical connectionsbetween a semiconductor chip and other components.