Search results for "miniaturisation"

Cost-efficient and resources-saving device connection via only one pair of wires is a pioneering trend in industrial cabling.

Specialist distributor of electronic and technical components, Distrelec, is bringing to the market Weller Tools’ smart soldering platform WXsmart.

For the first time, Heraeus Electronics will exhibit at SEMICON Korea, scheduled to take place 1st – 2nd February 2023, at COEX in Seoul, Korea. At the exhibition, Heraeus Electronics will show a wide range of innovative materials to enhance power modules and semiconductor device performance.

NXP Semiconductors has announced its collaboration with the German Aerospace Centre (DLR) and other partners on ion trap-based quantum computers as part of the DLR’s Quantum Computing Initiative.

ROHM developed automotive-grade LDO regulator ICs: the BUxxJA3DG-C series (BU12JA3DG-C, BU15JA3DG-C, BU18JA3DG-C, BU25JA3DG-C, BU30JA3DG-C, BU33JA3DG-C).

Addressing the stringent performance and power demands of 5G/6G SoCs,Synopsys,Ansys andKeysight Technologies have announced the availability of their millimetre wave (mmWave) radio frequency (RF) design flow for TSMC's 16nm FinFET Compact (16FFC) technology.

The sensor segment of automotive electronic components will grow at a double-digit CAGR of10%through 2029.

Pickering Electronics, the reed relay company which has pioneered miniaturisation and high performance for over 50 years, has signed a global distribution deal with Premier Farnell, an Avnet Company.

Healthcare organisations are increasingly moving patients to home care settings to reduce the pressure on traditional healthcare facilities, especially since the COVID-19 pandemic.

Molex announced the results of a global survey of design engineering stakeholders to identify market drivers impacting the development of diagnostic wearables that enable patients, caregivers and consumers to monitor and analyse data regarding health status.