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Biomedical engineers from the University of Melbourne have developed a high-speed 3D bioprinting system capable of creating structures that closely mimic a range of human tissues, from soft brain tissue to tougher materials like cartilage and bone.

CyrusOne has announced new research revealing the public perception and attitudes towards data centres, indicating that they are more favourable than initially anticipated.

Concordia University researchers have introduced a new approach to 3D printing that utilises acoustic holograms. This breakthrough method, known as holographic direct sound printing (HDSP), could offer faster and more complex printing capabilities than conventional techniques, potentially transforming applications across numerous sectors.

Advantech has announced its Arm-Based HMI TPC-100W series, featuring NXP's i.MX 8M Mini quad-core processor, has achieved Arm SystemReady IR certification.

The UK’s market for ensuring thetrustworthiness of AI systemsis poised to grow six-fold over the next decade – unlocking more than £6.5 billion as the UK government uses AI to kickstart growth.

European scientists are using diamonds tobuild a new quantum computerthat works without needing to be cooled to ultra-low temperatures.

Electrification and digitalisation are profoundly transforming the automotive industry. While some carmakers have recently scaled down their electrification plans, we envision a future where affordable hybrid and electric cars will be predominant in the market.

Increasingly complex industrial applications place high demands on connector systems, particularly where limited installation space is available. binder, a specialist in circular connectors, is expanding its product portfolio with angled M5 panel mount connectors.

Arteris, a provider of system IP which accelerates system-on-chip (SoC) creation, announces Tenstorrent has licensed its network-on-chip (NoC) IP for on-chip connectivity in its chiplet-based products.

ST AIoT Craft, a new web-based tool fromSTMicroelectronics, simplifies developing and provisioning node-to-cloud AIoT (Artificial Intelligence of Things) projects that use the machine-learning core (MLC) of ST’s smart MEMS sensors.