Search results for "NTT Corporation"
Indium to host free webinar on e-mobility electronics
Indium Corporation’s Principal Engineer – Advanced Materials, Andy C. Mackie, PhD., will conduct a webinar on the rapid advancements taking place within e-mobility electronics technology.
Bletchley Park and AI investment study
Just over two fifths (43%) of businesses responding to a recent Zoho survey*, have called for the Government to increase funding for businesses developing AI technologies to promote innovation, as the UK seeks to establish itself as a global AI leader.
NEC launches new AI business strategy
NEC has enhanced and expanded the performance of its lightweight large language model (LLM) and is scheduled to launch it in the spring of 2024.
SEMI announces new board members
SEMI, the industry association serving the global electronics design and manufacturing supply chain, has announced the election of two new members to the SEMI International Board: Kai Beckmann, Member of the Executive Board and CEO of the Electronics business sector of Merck KGaA, Darmstadt, Germany; and Benjamin Loh, Chair of the Management Board and President and CEO of ASM.
Biometrics rise against AI fraud
A new International Data Corporation (IDC) InfoBrief, sponsored by Mitek, Biometrics Key to Customer Satisfaction and Combating AI-Generated Fraud*, has been released.
SEMICON Japan 2023 showcasing emerging technologies
SEMICON Japan opens 13th Dec. at Tokyo Big Sight with more than 900 exhibitors from 19 regions showcasing their latest products and technologies.
Gaute Myklebust announced as new interim CEO of TouchNetix
TouchNetix AS, a provider of human machine interface (HMI) semiconductor chips and sensor modules, announced the appointment of Gaute Myklebust as interim CEO.
Advantest add two new products to device handler portfolio
Advantest Corporation announced two new products designed to deliver advanced handling capabilities essential for the fast-growing AI and high-performance computing (HPC) markets: the HA1200 die-level handler and the active thermal control (ATC) 2-kilowatt (kW) option for the M487x handler series.
ROHM and Toshiba agree to collaborate in manufacturing power devices
A plan by ROHM and Toshiba Electronic Devices and Storage to collaborate in the manufacture and increased volume production of power devices has been recognised and will be supported by the Ministry of Economy, Trade and Industry as a measure supporting the Japanese Government’s target of secure and stable semiconductor supply.
Thermal gels target mission critical electronics
The Chomerics Division of Parker Hannifin Corporation has launched two high-performance, high-reliability, fully cured dispensable thermal gels.