Search results for "Master Bond"
Smiths expands attenuator range
Smiths Interconnect has expanded its range of high-frequency surface mount chip attenuators with the introduction of the TSX Wire Bondable Fixed Chip Attenuator Series.
WE United walk for Women in Electronics
On Friday, 7th June 2024, Electronic Specifier’s Sheryl Miles and Sophie Mae Mcpherson joined forces with WE United’s UK and Ireland chapter to take part in a sponsored 5k walk-a-thon along London’s Southbank.
Celebrating the life of computing pioneer Lynn Conway
Lynn Ann Conway, a pioneer in computer science and electrical engineering and a professor emerita at the University of Michigan, passed away on 9thJune 2024, at her home in Jackson due to a heart condition. She was 86.
Indium expert to present at HiTEN conference
Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN 2024), taking place 15–17 July 2024 in Edinburgh, Scotland, UK.
Imec demonstrates functional monolithic CFET devices
This week, at the 2024 IEEE Symposium on VLSI Technology & Circuits (2024 VLSI), imec presents for the first time electrically functional CMOS CFET devices with stacked bottom and top source/drain contacts.
Lynred showcases infrared sensor Seegnus at Eurosatory
Lynred, a global provider of high-quality infrared sensors for the aerospace, defence, and commercial markets, announces it will showcase Seegnus, its first very compact high-resolution (1280 x 1024 SXGA format), small pixel pitch (7.5µm) midwave (MWIR) ‘HOT’ (high operating temperature) infrared sensor, at Eurosatory, Paris, 17–21 June 2024, at booth #5A-C155.
Quaze Technologies shows wireless power transfer at DSEi
Quaze Technologies is introducing its autonomous wireless power transfer capabilities to the defence sector at DSEi 23 in London (September 12-15).
SEGGER introduces Device Provisioner for target device configuration
SEGGER announced the Device Provisioner for its Flasher family of in-circuit programmers and its J-Link and J-Trace family of debug and trace probes.
Seica Battery show Stuttgart
SEICA is pleased to announce that they will once again be present at the Battery show in Stuttgart at Booth B16 in Hall 8, displaying the latest innovative test solutions developed specifically for the EV sector.
Strong basis for customer-specific power modules
CeramTec is launching a new product, Sinalit, just in time for this year's PCIM Europe trade fair for power electronics in Nuremberg, Germany.