Search results for "Infineon"
SEMICON Europa to explore advanced packaging and fab management
Semiconductor industry experts will convene at SEMICON Europa 2024,12–15 November 2024 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.
Imagimob's Edge AI solutions for the AURIX product family
Imagimob, an Infineon company, has enhanced its automotive machine learning portfolio by integrating machine learning capabilities into Infineon's Automotive ASIL-D complaint MCUs like AURIX TC3x and AURIX TC4x.
electronica 2024 highlights supporting programme
In just a few weeks, electronica 2024, alongside SEMICON Europa, will open its doors in Munich. From 12–15 November 2024, more than 3,000 exhibitors from around the globe will showcase their latest products and solutions.
Electronic Specifier to host Cyber Security Forum at electronica
Electronic Specifier is once again looking forward to hosting thecyber securityforum at electronica 2024 in November this year.
Infineon adds new industrial and automotive grade devices
In static switching applications, power designs focus on minimising conduction losses, optimising thermal behaviour, and achieving compact and lightweight systems while ensuring high quality at a low cost.
Use a complete Wi-Fi/Bluetooth combo module to simplify IoT connectivity
A positive feedback loop between technology and product advances works like this: technological advances increase market demand for products, while this demand drives further advances. This cycle repeats, and costly and rare components and products quickly become inexpensive commodities. Think personal computers, smartphones, and flat-screen TVs.
MathWorks package automates code generation to Qualcomm Hexagon NPU
MathWorks, the developer of mathematical computing software, announces the availability of a hardware support package for the Qualcomm Hexagon Neural Processing Unit (NPU), the technology embedded within the Snapdragon family of processors.
DELO carries out studies on miniLED dice
DELO has carried out internal feasibility studies, demonstrating the successful electrical and mechanical bonding of miniLED dice using directional conductive adhesives.
PCIM Asia 2024 concludes its most expansive event to date
PCIM Asia2024, Asia’s leading international platform for communication and exchange in power electronics, intelligent motion, renewable energy and energy management, concluded on 30th August 2024 at the Shenzhen World Exhibition and Convention Centre in China.
Infineon adds 650 V TOLL portfolio to its CoolSiC MOSFET family
As digitalisation, urbanisation, and the rise of electro-mobility continue to shape the rapidly evolving world, the demand for power consumption is reaching unprecedented levels.