Search results for "Blu Wireless"
Anglia and Digi partner for SoM webinar
A webinar introducing Digi’s versatile, secure, wireless System-on-Module (SoM) will be aired on October 22 at 11am BST.
Eggtronic launches board for efficient wireless power transfer
Eggtronichas unveiled a newevaluation boardthat allows engineers to quickly develop and prototype ultra-efficient, low-component count wireless power transfer designs for low-power applications.
Wireless Connectivity Technology Selection Guide
Selecting the right wireless connectivity technology is a critical design decision from the beginning. This determines the protocol interoperability, distance, robustness and the use-cases for your application. This selection guide will walk you through several key decision requirements starting with the table below as a high-level summary of various wireless connectivity technologies.
Series 16 – Episode 2 – EEA Award winner discusses LDS technology and antenna design
Paige West speaks with Carmen Redondo, Director, Global Marketing Antennas, KYOCERA AVX aboutwinning the Electronics Excellence Awardand its UWB LDS Antenna – Tulip.
EnSilica to design ASICs for next-generation telecom equipment
SIAE MICROELETTRONICA, a provider of microwave radio and wireless network solutions, has selectedEnSilica, a turnkey supplier of mixed signal ASICs and SoCs, to assist the design of Application-Specific Integrated Circuits (ASICs) for its next-generation telecommunication infrastructure products.
DigiKey launches Factory Tomorrow Season 4 on industrial automation
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, announces the debut of Season 4 of the Factory Tomorrow video series sponsored bySiemensandBanner Engineering.
Advanced Energy introduces efficient converter module
Advanced Energy has introduced a new ultra-efficient and highly reliable DC-DC converter module. This cutting-edge 1,300 W device offers a 28V output in a standard half-brick form factor, reducing energy consumption while incorporating integrated remote digital control capabilities.
Samsung electro-mechanics unveils high-voltage MLCCs for growing EV market
Samsung Electro-Mechanics has introduced a new line of multi-layer ceramic capacitors (MLCCs) designed to meet the increasing demand for high-voltage components in the electric vehicle (EV) industry. These new 1812-inch X7R MLCCs offer capacitance values ranging from 2.2nF to 470nF, with a notable rated voltage of up to 2000Vdc, making them ideal for high-voltage EV applications.
SECO at embedded world North America 2024
SECO has announced its participation in the inauguralembedded world North America, taking place in Austin, Texas, from 8-10thOctober 2024.
Will the brain-computer interface market thrive before Neuralink?
The headlines have been full of exciting announcements about new brain-computer interface technologies that can read our minds.