Search results for "NXP"
NXP’s GreenChip Brings Energy Efficiency to Netbook Adapters
NXP Semiconductors today announced the launch of GreenChip TEA1733 - a low-cost IC that increases energy efficiency and standby performance of power supplies under 75W. Designed specifically for low-power computing and communication applications such as netbook adapters, printer adapter and LCD monitor supplies, the TEA1733 is a Switched Mode Power Supply (SMPS) controller IC that enables standby power levels less than 100mW. The GreenChip TEA173...
NXP HPRF Design Challenge cartoon
Introduction to NXP's HPRF Design Challenge
NXP eCall Trial 2010 introduction
NXP Semiconductors N.V. (NASDAQ: NXPI) and its partners launch a pan-European field trial of the eCall emergency system, which automatically calls emergency operators in the event of a road accident.
NXP - The next step in retrofit LED lighting
NXP's AC main LED driver IC family and software support.
NXP Announces Integrated LED Driver for LCD Backlighting Displays
NXP Semiconductors N.V. today announced its 3-channel LED driver, the UBA3077, for use in backlighting Liquid Crystal Displays (LCD). Based on NXP GreenChipT technology, the UBA3077 is a fully integrated switched-mode solution for multi-channel applications supporting the growing popularity of LED as a backlight source for TVs and PC monitors, as well as general lighting applications. For LCD backlighting, the UBA3077 drives LED strings with a ve...
NXP - First Leadless Package With Tin-Plated, Solderable Side Pads
NXP Semiconductors announced the availability of SOD882D, the industry’s first leadless package with solderable, tin-plated side pads. The SOD882D is a 2-pin plastic package measuring only 1mm x 0.6mm and is ideal for small and thin devices. With a height of only 0.37 mm (typical), it is also one of the flattest packages in the 1006-size (0402 inch) and is available in various ESD protection and switching diodes.
Personalised workbench app empowers engineers
Starting today engineers can more easily browse, store and link products to projects using NXP Semiconductors’ N.V. newest mobile app – ‘Tech bench.’ Tech bench is an intuitive, feature-rich iPAD app allowing engineers to access NXP’s full product portfolio; to collect datasheets, application notes and quality information; and to ‘drag and drop’ product or application data in self-defined project sections.
NXP Ships Dual Silicon Tuner for Cable
NXP announced the TDA18260, a dual silicon tuner for cable, is in volume production and available immediately. The TDA18260 simplifies the design of high-definition multi-tuner cable set-top boxes, enabling up to 6 channels with high performance on each stream. The dual cable silicon tuner IC from NXP eliminates tuner-to-tuner interference as well as the need to add complex, costly RF components such as low-noise amplifiers, splitters, Surface A...
Sony Ericsson selects NXP’s NFC Solution for its Android-based Smartphones
NXP Semiconductors announced that its near field communication (NFC) technology has been selected by Sony Ericsson for inclusion in its Android-based smartphones. Sony Ericsson, a leading, global mobile handset manufacturer focused on communications and entertainment, will use NFC to further enhance its consumers’ mobile experiences, creating a portfolio of smartphones that enable mobile transactions. Using simple touch gestures, consumers wi...
austriamicrosystems and NXP Semiconductors collaborate to deliver turnkey solution for authentication of fast moving consumer goods
austriamicrosystems today announced that they have jointly developed the first in a range of reference solutions for product authentication in embedded consumer applications. Leveraging the AS399x UHF RFID Reader IC, and the UCODE G2iL series, the reference design delivers the industry’s lowest power consumption, lowest solution cost, lowest complexity and highest level of integration – a combination unmatched anywhere in the world.