Search results for "STMicroelectronics "

PHYTEC America has teamed with ZT Systems and STMicroelectronics to deliver the world’s first commercially-available software development platform utilizing low power ARM processor technology for the server market. The R1801e server solution is a breakthrough for energy efficiency and density that addresses both the economic and ecological impact of data centers with tremendous potential.

Test solutions specialist A.T.E. Solutions has been appointed as exclusive UK representative for Algocraft and its WriteNow! In-System Programming (ISP) products. Under the appointment A.T.E. Solutions will provide technical support for Algocraft’s products and be able to integrate the ISP capability into its custom test solutions.

Analysis of findings from the recently published Semicast report “Opportunities for ARM in Embedded Processing—2011 Edition” suggest the rapid growth of the ARM architecture is set to continue over the medium term, with annual shipments of ARM-based processors set to match the world’s population this year and forecast to equal twice the world’s population in 2015.

STMicroelectronics and Wasion Group announced the availability of NFC-enabled post-pay power meters for deployment in the municipal grid of ChongQing, China. Wasion’s new meters rely on ST’s Near-Field Communication technology enabling convenient mobile payments of electricity bills with uncompromised data security.

The MIFARE4Mobile Industry Group, consisting of leading players in the Near Field Communication (NFC) ecosystem including Ericsson, Gemalto, Giesecke & Devrient, NXP Semiconductors, Oberthur Technologies, STMicroelectronics and ViVOtech, today announced the new roadmap for MIFARE4Mobile™ specifications.

SILICA today announced the launch of a major growth programme called Core 'n More, which provides a focus for the company's comprehensive portfolio of microcontroller solutions, tools, software support and design-in services.

Yole Développement's FOWLP Patent Analysis is now available. Fan-Out Wafer Level Packaging is the most innovative advanced packaging technology today, adopted for mobile phone and consumer electronics applications. After several years of specific analysis for customers, Yole Développement has decided to publish its first analysis of the technical contents of patents.

STMicroelectronics has expanded its portfolio with next-generation micro-machined acoustic devices. The innovative MEMS microphones that use sensor technology from OMRON will significantly raise the bar in sound quality, reliability, and cost-effectiveness for existing and emerging audio applications like cell phones, wireless devices and games that respond to voice inputs, across a range of market segments.

STMicroelectronics today introduced new smart pushbutton ‘on/off’ controller ICs that will improve the user experience for virtually any battery-powered portable device, including e-readers, tablets, media players, smartphones and digital cameras. These new chips will enable next-generation mobile products to offer easy-to-use ‘power-up’, ‘power-down’ and ‘unfreeze/reset’ functions that will prevent damage to the end-user product...

STMicroelectronics has introduced a device that provides an extra channel of ESD (Electro-Static Discharge) protection within the same dimensions as competing alternatives — 25% more channels to deliver a space-efficient solution for designers of feature-rich, tightly packed portable gadgets such as netbooks and smartphones.