Search results for "ASIC"
The weakest link in wireless access control
Wireless access control is only as strong as its weakest link, as Vivien Delport, Director of Applications Engineering Security, Microcontroller and Technology Division and Cristian Toma, Applications Engineer of Microchip Technology Inc. explain.
National Instruments Introduces Industry’s Highest Performance PXI Digitizers
GHz and 5 GHz Digitizers Feature Tektronix®, Enabling Technology and Extend Digitizer Performance for Automated Test Applications
Avnet Memec expands European distribution agreement for Renesas with Industrial Automation products
Avnet Memec announced today the expansion of its pan-European distribution agreement with Renesas Electronics Europe to include industrial automation products such as IO Link, ERTEC and Ethernet Controllers & PHYs supporting IEEE1588 v2.
Algotronix announces an XTS-AES IP core for storage applications
Algotronix Ltd., Edinburgh, UK announces the availability of an XTS-AES core to meet the NIST SP800-38E recommendation published in January 2010 and the IEEE 1619-2007 standard. The IP core provides encryption for data storage applications and can be configured to exceed the demands of SATA 3.0 and USB 3.0, as well as smaller footprint configurations for less demanding requirements. The low-cost core features a hardware AES encryption solution t...
Broadcom and Emulex Reach Partial Settlement and Worldwide Patent Agreement
Broadcom and Emulex have announced today that the companies have entered into a partial settlement and worldwide patent license agreement relating to the patent litigation in the U.S. Federal District Court in Santa Ana, California. The agreement will result in the dismissal of certain of Broadcom's infringement claims against Emulex.
KaiSemi Will Showcase its Zero NRE Automated FPGA-to-ASIC Replacement at ESC Silicon Valley
KaiSemi Ltd., a fabless semiconductor vendor, announced that it will exhibit at the Embedded Systems Conference (ESC) Silicon Valley 2011, being held May 3-5 at the McEnery Convention Center in San Jose, California.
Uniquify Launches ideas2silicon Design Services Platform
Uniquify today launched ideas2silicon, a new and comprehensive design services platform that spans chip specification and design through volume delivery of packaged and tested parts. ideas2silicon turns the model upside down by offering faster turnaround, lower costs and a transparent business model that gives project teams complete visibility into the cost structure.
Uniquify Extends Patented Timing Calibration Innovation to Solve Dynamic Variation in DDR Memory Subsystems
Uniquify today announced that it has extended its patented self-calibrating logic IP for double data rate (DDR) memory subsystems to solve dynamic variation problems during system operation. Dynamic Self-Calibrating Logic (DSCL) provides real-time calibration to accommodate dynamic variations in the system operating environment.
“The MEMS packaging, assembly, test & calibration market will reach $2.3B value by 2016, growing three times faster than the overall IC packaging industry,” forecasts Yole Développement
Yole Développement announces its report “MEMS Packaging”. This report is featuring a full analysis of packaging, assembly & test requirements application by application as well as a dedicated focus on MEMS package substrates.
NXP Boosts RF Innovation with Next Generation SiGe:C BiCMOS QUBIC4 Technology
NXP has announced its next generation radio frequency technology with its highly advanced QUBIC4 BiCMOS silicon devices delivering higher levels of integration and performance at high frequencies, all in a cost effective way. NXP's commitment to furthering the development of QUBIC4 BiCMOS will now enable future generations of RF products such as low noise amplifiers, medium power amplifiers and LO generators for e.g. mobile phones and communicat...