Search results for "semiconductor"

Efficient Power Conversion (EPC) has announced that the China National Intellectual Property Administration (CNIPA) has validated the claims of EPC patent titled “Compensated gate MOSFET and method for fabricating the same” (Chinese Patent No. ZL201080015425.X) for enhancement-mode GaN semiconductor devices.

ROHM has developed a zero-drift operational amplifier (op amp) – theLMR1002F-LB.

Vishay has extended its rollout of Critical Manufacturing’s MES from its initial site in the USA in 2019 to now include Vishay’s semiconductor manufacturing facilities.

ASMPT will present its semiconductor assembly and packaging solutions at Productronica 2023.

The new SMT Analytics software from ASMPT evaluates the SMT process in detail by identifying and locating problematic aspects that often go unnoticed and can lead to shortfalls in efficiency and performance. The innovative software helps employees to detect the causes of trouble, highlights potential losses, and points out potential improvements.

Navitas Semiconductor invites visitors to experience “Planet Navitas” and collaborate to “Electrify Our World” at APEC 2024, Long Beach, CA, 26th - 29th February 2024.

There are many pieces to any semiconductor product ‘puzzle’ that can result in obsolescence. These pieces range from business revenue to any one of the subcomponents that compose semiconductor products, such as foundry process technologies, packages, substrate or lead frames, test platforms, or design resources.

SweGaN AB, a European semiconductor manufacturer specialising in the development and production of high-performance Gallium Nitride on Silicon Carbide (GaN-on-SiC) epitaxial wafers, announced it has entered into a strategic partnership with South Korea-based RFHIC Corporation.

ROHM has added a lineup of compact 600V Super Junction MOSFETs – the R6004END4 / R6003KND4 / R6006KND4 / R6002JND4 / R6003JND4. These devices are ideal for small lighting power supplies, pumps, and motors.

ASMPT has unveiled the new version of the AMICRA NOVA Pro in Munich on 17th January 2024. This state-of-the-art platform merges high placement accuracy with swift cycle times and cutting-edge bonding technologies, marking a significant advancement in the field.