Search results for "e waste"

VARTA, a European battery manufacturer, has become the primary partner for the world’s first app employing artificial intelligence (AI) to identify and recycle recyclable materials.

Mouser Electronics has released a new eBook in collaboration with onsemi, exploring the use of silicon carbide (SiC) semiconductors for power system design.

Karen Mascarenhas first met with Marsha Marcus, Global Portfolio Manager, Collaborative Robots, KUKA in London, as the company celebrated its 125thanniversary in 2023.

New in Rutronik's ams OSRAM product portfolio are the DURIS E2835 LEDs for linear or flexible strip lighting.

SI Sensors specialises in designing innovative CMOS image sensors for ultra-fast cameras, enhancing the speed at which signal electrons are detected by increasing their velocity, thereby allowing faster detection within the photodiode.

A research team at the University of Virginia School of Engineering and Applied Science has explored how cellulose nanofibrils, a novel plant-based material, can enhance the benefits of 3D-printed concrete technology.

FORTEC UK has announced the launch of the Pico-ITX Board from AAEON powered by the ARM NXP i.MX8M Plus Quad-Core Cortex-A53 1.6GHz processor.

Mouser congratulates drivers Jean-Éric Vergne, Stoffel Vandoorne, and the DS PENSKE Formula E racing team for finishing in third place overall in the 2024 ABB FIA Formula E World Championship with 200 points. Vergne also finished fifth in the driver's standings with 139 points. Vandoorne finished tenth with 61 points.

Oscilloscopes with advanced FFT capabilities and high sensitivity and dynamic range are the ideal instruments for electromagnetic interference (EMI) debugging. MXO oscilloscopes from Rohde & Schwarz with their fast performance let design engineers swiftly and accurately detect and analyse EMI emanating from electronic circuits and boards with time-correlated RF analysis.

TTI Europe is now stocking Vishay’s fourth-generation 600V SiHR080N60E E Series power MOSFETs. Available in the new PowerPAK 8 x 8LR package, the device provides high efficiency and power density for telecom, industrial, and computing applications.